Semiconductor Package Layout With External Signal Path
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Solution Overview
Problem
In 2.5D integrated circuit packaging, interposers used for interconnections are limited by high cost and low yield, and signal transmission through substrates results in conduction loss, degrading performance.
Innovation Solution
A semiconductor device package design featuring discrete modules with interposers of varying specifications and a conductive element outside the substrate for signal transmission between modules, reducing cost and conduction loss by bypassing the substrate for signal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interposers are used for interconnections in 2.5D IC packaging, then signal transmission between electronic components is enabled, but manufacturing cost increases and yield decreases
Solution Approach 1:
The patent extracts the signal transmission function from the substrate and relocates it to conductive elements positioned outside the substrate. This separation allows the substrate to focus on mechanical support while signal transmission is handled by dedicated conductive paths, reducing complexity and cost.
Solution Approach 2:
The patent introduces conductive elements as intermediary components that bridge electronic components without requiring them to be directly connected through the substrate. These conductive elements act as mediators that enable signal transmission while simplifying the overall packaging structure.
2Reliability
If signal transmission path through substrate is used, then electrical connection between modules is achieved, but conduction loss occurs and performance degrades
Solution Approach 1:
The patent extracts the signal transmission path from the substrate interior and positions conductive elements on the substrate surface or outside it. This extraction creates shorter, more direct signal paths that minimize resistance and reduce conduction losses.
Solution Approach 2:
The patent transitions signal transmission from a through-substrate (vertical/diagonal) path to a surface-level (horizontal) path using conductive elements. This dimensional change enables shorter transmission distances and fewer interfaces, reducing conduction loss.
3Device complexity
If shared interposers are used for multiple module groups, then device complexity is reduced, but signal transmission distance increases and performance degrades
Solution Approach 1:
The patent segments the interconnection structure into multiple discrete conductive elements, each serving specific module groups. This segmentation allows each conductive element to be optimized for its specific signal transmission task, maintaining short transmission distances while keeping the overall device manageable through modular organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces package size and manufacturing costs while improving electrical performance and reliability by using non-shared interposers for different module groups and direct signal transmission through conductive elements, minimizing conduction loss.
Implementation Method 1
a conductive element disposed outside of the substrate and configured to provide a signal transmission path between the first module and the second module
Data Source
AI summary
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate, a first module disposed on the substrate, a second module disposed on the substrate and spaced apart from the first module, and a conductive element disposed outside of the substrate and configured to provide a signal transmission path between the first module and the second module.