External Storage Device USB 2.0 and 3.0 Compatibility
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Solution Overview
Problem
The slow adoption of the USB 3.0 standard is hindered by the need to redesign motherboard hardware and revise operating systems, and existing USB 2.0 COB sticks lack the necessary design to accommodate USB 3.0 connections due to their rectilinear configuration.
Innovation Solution
An external storage device design that allows for multiple interface connection standards, featuring a substrate with component and connection surfaces, where memory die stacks can be stacked and configured to include USB 2.0 and USB 3.0 connections, using a contact bar with spring-loaded extensions and mounting bars to ensure secure electrical coupling, enabling compatibility with both standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If USB 2.0 COB stick configuration is used with rectilinear design and components embedded on one side of PCB, then manufacturing simplicity and device compactness are maintained, but the ability to add USB 3.0 connection is lost
Solution Approach 1:
The patent transitions from a two-dimensional PCB surface mounting approach to a three-dimensional vertical stacking architecture. Memory dies are stacked vertically using through-silicon vias (TSVs) and interposer substrates, allowing USB 3.0 connectivity to be added without expanding the device footprint or significantly complicating the PCB layout. This vertical dimension enables multiple interface standards to coexist within the same form factor.
Solution Approach 2:
The external storage device is designed with multi-functionality to support both USB 2.0 and USB 3.0 connection standards simultaneously. The controller and memory stack configuration enables the device to operate with either interface type, making it universally compatible across different host systems without requiring separate device variants.
2Speed
If USB 3.0 connections are added to existing USB 2.0 COB sticks, then data transfer speed is improved, but the rectilinear design and component embedding configuration prevent easy integration
Solution Approach 1:
The storage device is segmented into modular components: memory dies, interposer substrate, controller, and packaging substrate. Each module can be manufactured independently and then assembled through vertical stacking. This segmentation allows USB 3.0 capability to be integrated by adding specific modules rather than redesigning the entire device, significantly improving ease of manufacture.
Solution Approach 2:
An interposer substrate is introduced as an intermediary component between the memory dies and the controller/packaging substrate. This interposer facilitates the complex electrical connections required for USB 3.0 high-speed data transfer while maintaining compatibility with existing USB 2.0 architectures. The interposer absorbs much of the integration complexity, making the overall manufacturing process more manageable.
3Quantity of substance
If memory components are arranged in vertical stacks with multiple dies per stack, then storage capacity and speed are increased, but manufacturing complexity increases
Solution Approach 1:
Memory dies are pre-assembled into stacks with established vertical alignment and electrical connections before being mounted to the packaging substrate. Through-silicon vias (TSVs) are pre-formed in the dies, and the interposer substrate is prepared with corresponding connection points in advance. This preliminary preparation reduces the precision requirements during final assembly, as the critical alignment work has already been performed on smaller, more manageable components.
Solution Approach 2:
The patent employs standardized interface configurations and repeated modular units across multiple memory stacks. Each stack follows the same architectural pattern with consistent TSV arrangements and interposer connections. This standardization allows manufacturing processes to be replicated across multiple units, reducing the cumulative precision requirements and enabling automated assembly techniques.
Data Source
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AI summary
Described are external storage devices (10) including a substrate (12), a controller (16) electrically coupled to the substrate, at least one memory die stack (18) electrically coupled to the substrate and a plurality of connection fingers (14) electrically coupled to the substrate; wherein the external storage device is configured to support at least two USB standards with interfaces that are mechanically different.