External Storage Device Tamper-Proof Inductor Integration
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Solution Overview
Problem
Existing external storage devices face challenges in ensuring tamper-proof properties, as software-based encryption methods can be circumvented by decryption software, making it difficult to prevent illegal duplication of content.
Innovation Solution
An external storage device design featuring a semiconductor chip with an inductor for non-contact information transmission, a driver circuit, and a sealing resin layer that seals the chip but not the external terminal, making it costly and difficult to replicate the device, thereby enhancing tamper-proof properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If software-based encryption is used to improve tamper-proof property, then content security is enhanced, but decryption software can circumvent it making tamper-proof property insufficient
Solution Approach 1:
The patent replaces software-based encryption with a hardware-based solution. An inductor is physically integrated into the semiconductor chip to enable non-contact information transmission, creating a hardware-level security mechanism that cannot be circumvented by software decryption tools.
Solution Approach 2:
The inductor acts as an intermediary component between the storage element and the external terminal. It enables wireless communication of stored information, adding a physical layer of complexity that prevents direct copying and requires specialized manufacturing equipment.
2Reliability
If an inductor is formed in a semiconductor chip for non-contact transmission, then tamper-proof property is improved, but manufacturing cost increases due to required semiconductor process facilities
Solution Approach 1:
The inductor is merged with the semiconductor chip structure, forming a single integrated component. This combination leverages existing semiconductor manufacturing capabilities while adding the wireless transmission function, making the solution more cost-effective than separate components.
Solution Approach 2:
The semiconductor chip serves multiple functions: storing information in the storage element and enabling non-contact transmission through the integrated inductor. This multi-functionality reduces the need for additional components and manufacturing steps.
3Volume of moving object
If the inductor diameter is reduced to minimize device size, then communication range decreases, but sealing resin layer thickness compensates for this limitation
Solution Approach 1:
The patent addresses the communication range limitation by changing the spatial dimension. Instead of increasing the inductor diameter (2D solution), the design utilizes the thickness dimension (3D solution) by reducing the sealing resin layer thickness, allowing the inductor to be closer to the external surface and extend the communication range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the creation of imitation devices by making it economically impractical to manufacture a compatible external storage device, thus significantly improving the tamper-proof property of the content.
Implementation Method 1
an inductor which is provided in at least the one semiconductor chip and which communicates information stored in the storage element to the outside
Data Source
AI summary
A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate.