External Terminal Convex Portions for Consistent Solder Thickness
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Solution Overview
Problem
Conventional electronic devices with external metal terminals suffer from joint failure and poor thermal shock resistance due to inconsistent solder thickness between chip components and terminal electrodes.
Innovation Solution
The electronic device features a terminal electrode connection part with convex portions that ensure a constant solder thickness by inserting solder into a fixed space, and a multilayer metal structure to improve equivalent series resistance and reduce stress, while a tin cover film prevents solder wet spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldering methods are used to connect external terminals to chip components, then the connection process is simple, but the solder thickness becomes inconsistent leading to joint failure and poor thermal shock resistance
Solution Approach 1:
The patent applies preliminary action by forming convex portions on the external terminal before the soldering process. These convex portions pre-establish fixed spacing and positioning features that guide the solder placement, ensuring consistent solder thickness before actual connection occurs. This preliminary structural preparation eliminates the inconsistency problem during soldering.
Solution Approach 2:
The convex portions act as intermediary elements between the external terminal and the chip component terminal electrodes. They mediate the connection by providing fixed reference points that control solder flow and thickness, ensuring uniform solder joints without requiring complex soldering process control.
2Productivity
If multiple chip components are connected to external terminals using conventional methods, then the device structure is simple, but joint failure occurs easily due to inconsistent solder thickness
Solution Approach 1:
The external terminal is segmented into multiple convex portions, each serving as an independent positioning and spacing feature for connecting chip components. This segmentation allows each connection point to have controlled solder thickness independently, improving overall joint reliability while maintaining efficient assembly of multiple components.
3Ease of manufacture
If solder is applied freely between external terminals and terminal electrodes, then the application process is simple, but solder spreads uncontrollably causing joint failure
Solution Approach 1:
The convex portions serve as intermediary structures that physically constrain solder flow. They create natural barriers that prevent solder from spreading beyond intended areas while still allowing simple solder application processes. The solder is contained within spaces defined by the convex portions, ensuring precise placement without complex control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces joint failure and enhances thermal shock resistance by maintaining consistent solder thickness and preventing solder spread, thereby improving the reliability of the electronic device.
Implementation Method 1
the terminal electrode connection part is provided with a plurality of convex portions protruding toward the terminal electrode, and at least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components. A space between the external terminal and the terminal electrodes of the plurality of chip capacitors has a fixed width between the convex portion and the convex portion
Implementation Method 2
the terminal electrode has a cover film containing tin, and side surfaces of the terminal electrodes touching each other adjacently in the first direction are joined by tin and tin. The convex portions have a function of preventing wet spreading of the solder
Implementation Method 3
The terminal electrode connection part of the external terminal has a multilayer structure of at least two metals. The terminal electrode connection part may be configured by a clad material having a multilayer structure of two layers or three layers, for example. In this configuration, an equivalent series resistance (ESR) can be improved while a stress at a solder connection part can be reduced
Implementation Method 4
at least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components
Data Source
AI summary
An electronic device includes a plurality of chip components and an external terminal. The chip components are provided with a terminal electrode formed on an end surface of a ceramic element body. The external terminal is electrically connected with the terminal electrodes to support the plurality of chip components adjacently in a first direction. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable with a mounting surface. The terminal electrode connection part is provided with a plurality of convex portions protruding toward the terminal electrode. At least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components.