External Terminal Non-Bonding Region Vibration Isolation
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Solution Overview
Problem
Electronic devices with external metal terminals experience acoustic noise during mounting on circuit boards due to vibration caused by electro-strictive effects, which existing technologies have not adequately addressed.
Innovation Solution
The design incorporates a non-bonding region between the terminal electrode connection part and the support part of the external terminal, which acts as a buffer to reduce vibration transmission, along with specific configurations such as grooves and solder adhesion prevention treatments to minimize acoustic noise and prevent solder bridges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external terminal is fully bonded to the terminal electrode, then electrical connection is improved, but acoustic noise increases due to vibration transmission
Solution Approach 1:
The bonding region between the external terminal and terminal electrode is divided into two distinct segments: a bonding region where solder connects the terminal electrode connection part to the end surface electrode part, and a non-bonding region extending from the bonding region to the support part. This segmentation allows the electrical connection function to be localized to the bonding region while the non-bonding region acts as a vibration buffer to reduce acoustic noise transmission to the mounting surface.
2Strength
If the external terminal is fully bonded to the terminal electrode, then mechanical strength is improved, but acoustic noise transmission to mounting surface increases
Solution Approach 1:
Different regions of the external terminal are assigned different bonding characteristics: the terminal electrode connection part has a bonding region with solder for strong mechanical connection and electrical conductivity, while the support part has a non-bonding region without solder to minimize vibration transmission. This local differentiation of bonding quality allows the structure to simultaneously achieve mechanical strength where needed and vibration isolation where harmful.
3Reliability
If solder is applied to the entire external terminal, then electrical and mechanical connection is improved, but solder bridges may form causing defects
Solution Approach 1:
The external terminal structure is segmented into regions with different solder application requirements: the terminal electrode connection part has a bonding region where solder is applied for reliable connection, while the support part has a non-bonding region where solder is excluded. This segmentation prevents solder from forming bridges to adjacent structures while maintaining connection reliability in the bonding region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces acoustic noise by inhibiting the transmission of electro-strictive vibrations to the mounting surface, while maintaining mechanical strength and preventing solder bridges, thereby enhancing the device's reliability and durability.
Implementation Method 1
a non-bonding region is formed from the terminal electrode connection part to the support part... the non-bonding region functions as a buffer region of vibration and that electro-strictive vibration of the chip capacitor is hard to transmit to the mounting surface
Implementation Method 2
vibration caused by electro-strictive effect at the time of application of high frequency voltage to ceramic layers constituting most of the element body transmits to the external terminal and/or the mounting surface
Data Source
AI summary
An electronic device includes a chip component and an external terminal. The external terminal includes a terminal electrode connection part, a mounting connection part, and a support part. The terminal electrode connection part is arranged to face an end surface electrode part of a terminal electrode of the chip component. The mounting connection part is connectable to a mounting surface. The support part faces one side surface of an element body of the chip component closest to the mounting surface so as to support the one side surface spaced from the mounting surface. A bonding region and a non-bonding region are formed between the terminal electrode connection part of the external terminal and the end surface electrode part of the terminal electrode. The non-bonding region is formed from the terminal electrode connection part to the support part.