Externally Configurable Integrated Circuit Design
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Solution Overview
Problem
Current circuit design methods either lack flexibility due to hardwired integrated circuits or face issues with component variability and parasitics when using discrete components, particularly at higher RF frequencies.
Innovation Solution
Designing a die with individual active electronic components that are not initially interconnected on the die, allowing for external interconnections via methods like wire bonding, enabling flexible circuit formation and reducing processing variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete components are used to build a circuit, then flexibility in placing and interconnecting components is improved, but manufacturing precision and component identity deteriorate due to processing variations
Solution Approach 1:
The patent segments the circuit into multiple individual active electronic components that are separately formed on the die substrate. Each component can be independently positioned and interconnected through external connections, allowing flexibility in circuit configuration while maintaining manufacturing precision through integrated circuit fabrication processes.
Solution Approach 2:
The patent introduces external interconnections as an intermediary between the active electronic components on the die. These external interconnections allow flexible routing and configuration while the components themselves are manufactured with high precision using integrated circuit processes, thus resolving the contradiction between flexibility and manufacturing precision.
2Ease of operation
If discrete components are used, then ease of operation in circuit design is improved, but parasitic effects worsen at higher RF frequencies
Solution Approach 1:
The patent merges the advantages of discrete component design with integrated circuit fabrication by forming multiple individual active electronic components on a common die substrate. This integration reduces the parasitic effects associated with discrete components while maintaining the design flexibility and ease of operation, particularly at higher RF frequencies.
3Manufacturing precision
If integrated circuits are used, then manufacturing precision and component identity are improved, but adaptability and flexibility in circuit configuration deteriorate
Solution Approach 1:
The patent introduces dynamic configurability to the integrated circuit through external interconnections. The active electronic components are formed with high precision on the die, but their interconnections can be dynamically configured externally to create different circuit arrangements, thus maintaining both manufacturing precision and adaptability.
4Ease of operation
If discrete components are used, then ease of operation is improved, but device complexity increases due to individual packaging
Solution Approach 1:
The patent combines multiple individual active electronic components onto a single die substrate, reducing the overall device complexity associated with individually packaged discrete components. The components maintain their individual characteristics and can be independently interconnected, preserving ease of operation while reducing packaging complexity.
Data Source
AI summary
A die comprising two or more active electronic components is provided. The active electronic components are capable of being interconnected using interconnections external to the die. The die may be encased within a package, and the active electronic components may be interconnected using interconnections external to the package. By interconnecting the active electronic components, either directly or through one or more additional components, a desired circuit may be formed. In some examples, the desired circuit may be a monolithic microwave integrated circuit (MMIC). Methods of forming the circuit are also disclosed.