Externally Fused Safe Capacitor with Resistive Load
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Solution Overview
Problem
Existing capacitor designs face challenges in failing safely to prevent damage to circuits due to material compatibility issues between Precious Metal Electrodes (PME) and Base Metal Electrodes (BME) systems, and the high cost and complexity of integrating resistors and fuses with capacitors using thick film technology.
Innovation Solution
A safe capacitor design incorporating a ceramic substrate with a resistor and/or fuse connected in parallel or series with one or more capacitors, allowing for a resistive load failure mode and rapid discharge, compatible with both PME and BME metallization technologies, and manufactured using cost-effective methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thick film technology is used to integrate resistors and fuses with capacitors, then functional integration is achieved, but manufacturing cost and complexity increase significantly
Solution Approach 1:
The patent divides the capacitor structure into separate functional segments: the capacitor element and the safe circuit (resistor and fuse) are integrated as distinct but connected components. This segmentation allows each component to be optimized independently while achieving functional integration, reducing manufacturing complexity compared to monolithic thick film integration.
Solution Approach 2:
The patent introduces an intermediary approach by using a substrate that can receive both capacitor elements and safe circuit components. This substrate acts as a mediator that facilitates integration without requiring complex thick film processes, thereby reducing manufacturing complexity while maintaining functional integration.
2Manufacturing precision
If individual capacitor printing is performed, then precise circuit patterns are achieved, but extensive tooling and automation are required
Solution Approach 1:
The patent merges multiple printing operations into a single integrated process by applying both capacitor and safe circuit patterns in one printing step. This consolidation maintains circuit pattern precision while eliminating the need for extensive tooling and automation between separate printing steps, thereby reducing manufacturing complexity.
Solution Approach 2:
The patent creates a universal printing approach that can produce both capacitor elements and safe circuit patterns using the same printing system. This multi-functional printing method achieves precise circuit patterns without requiring specialized tooling for different components, reducing automation requirements and simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable performance at elevated temperatures, design flexibility, and cost-effective integration of safe circuits with capacitors, preventing damage from catastrophic failures and ensuring safe discharge of energy.
Implementation Method 1
BME systems, which typically utilize nickel, are dramatically less expensive and are therefore preferred. Unfortunately, BME systems must be fired in a reducing atmosphere in order to keep the nickel from oxidizing.
Implementation Method 2
thick film materials are designed to be fired in an air atmosphere
Implementation Method 3
Thin film metallization is based on vapor deposition of materials onto a surface.
Data Source
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AI summary
A capacitor combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor results in a resistive failure when the fuse opens during an overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.