Extra-Die Heat Transfer Posts for Stacked Silicon Thermal Management
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Solution Overview
Problem
Conventional chip packaging schemes face challenges in providing adequate thermal management, particularly in applications with high-bandwidth memory and logic dies, leading to potential device failure due to thermal junction temperature limits being exceeded.
Innovation Solution
The implementation of extra-die heat transfer posts between a cover and a substrate in a chip package assembly, which provide robust heat transfer paths laterally outward of the integrated circuit (IC) dies, enhancing thermal management and reducing thermal coupling and temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional chip packaging schemes are used with IC dies mounted on a package substrate, then component density and functionality are increased, but thermal management becomes inadequate and thermal junction temperature limits are exceeded
Solution Approach 1:
The patent segments the thermal management function by introducing multiple discrete heat transfer posts distributed across the package substrate. Each post acts as an independent heat transfer pathway, collectively providing sufficient thermal dissipation capacity to handle high-power IC dies while maintaining component density.
Solution Approach 2:
The heat transfer posts serve as intermediary thermal conduits between the IC dies and the package substrate. These posts mediate the heat transfer process by providing high-thermal-conductivity pathways that efficiently conduct heat away from the dies, preventing temperature buildup while maintaining the compact packaging structure.
2Adaptability or versatility
If high-bandwidth memory and logic dies are integrated in a single package assembly, then functionality and performance are enhanced, but thermal management becomes problematic and device failure risk increases
Solution Approach 1:
The patent applies local quality by strategically placing heat transfer posts in specific locations around high-power IC dies. The posts are positioned to provide targeted thermal management where heat generation is highest, ensuring that critical areas receive adequate cooling while maintaining overall package functionality and reliability.
Solution Approach 2:
The patent addresses thermal management by adding a vertical dimension to heat dissipation through the heat transfer posts that extend from the package substrate through the IC dies to the top surface. This three-dimensional heat transfer pathway complements the planar component layout, enabling effective thermal management without compromising the two-dimensional component density and functionality.
3Stability of the object's composition
If small fluctuations in ambient temperatures occur, then system stability is maintained, but thermal junction temperature limit is quickly exceeded resulting in device failure or system shutdowns
Solution Approach 1:
The patent implements preliminary action by pre-establishing multiple heat transfer posts during package fabrication, creating redundant thermal pathways before the device operates. This ensures that adequate heat dissipation capacity is built-in from the start, providing a thermal management safety margin that prevents temperature excursions even when ambient conditions fluctuate.
Solution Approach 2:
The heat transfer posts provide beforehand cushioning against thermal runaway by creating multiple parallel heat dissipation pathways. This redundant thermal infrastructure acts as a buffer or cushion that absorbs thermal stress and prevents small ambient temperature fluctuations from cascading into critical temperature excursions that would cause device failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the reliability and performance of chip package assemblies by effectively managing heat, reducing the risk of device failure and extending electromigration (EM) lifetime by providing enhanced heat transfer and temperature control.
Implementation Method 1
The extra-die conductive posts provide heat transfer paths between the cover and substrate that is laterally outward of the first IC die
Data Source
AI summary
A chip package assembly and method for fabricating the same are provided which utilize a plurality of extra-die heat transfer posts for improved thermal management. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate, a cover disposed over the first IC die, and a plurality of extra-die conductive posts disposed between the cover and substrate. The extra-die conductive posts provide a heat transfer path between the cover and substrate that is laterally outward of the first IC die.