Extra-Package Heat Conductors for Through PCB Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip packaging schemes face challenges in providing adequate thermal management for micro devices, particularly in applications with high current and power usage, as it is difficult to route heat out of the chip package without interfering with solder balls and electrical connections on the printed circuit board.
Innovation Solution
The implementation of extra-package heat conductors disposed laterally outward of the chip package, which provide a thermally conductive heat transfer path through the printed circuit board to a thermal management device, allowing heat to be removed from the bottom of the chip package without disrupting electrical connections and enabling efficient heat transfer to a thermal management device above the chip package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chip packaging schemes are used with solder balls on the PCB, then electrical connections are established, but thermal management becomes difficult due to interference with solder ball placement
Solution Approach 1:
The patent introduces extra-package heat conductors that extend laterally outward from the chip package in a direction perpendicular to the conventional vertical heat path. This dimensional change allows heat to be conducted away from the package without interfering with the solder ball placement area on the PCB, thus resolving the spatial conflict between electrical connections and thermal management.
Solution Approach 2:
The thermal management function is segmented into multiple independent heat conduction paths: conventional vertical paths through the PCB and new lateral paths through extra-package heat conductors. This segmentation allows the electrical connection function (solder balls) and thermal management function (heat conductors) to operate independently without mutual interference.
2Productivity
If active components are mounted close to package substrates to increase component density, then functionality is improved, but heat routing becomes challenging
Solution Approach 1:
By extending heat conductors laterally outward from the package in a direction parallel to the PCB surface, the patent creates additional thermal pathways that do not compete for space with closely mounted active components. This allows high component density to be maintained while improving heat transfer efficiency through the extended lateral paths.
3Reliability
If the area below the package is preserved for solder balls, then electrical connections are maintained, but thermal management capability is reduced
Solution Approach 1:
The patent segments the thermal management function into vertical heat paths (through the PCB via solder ball areas) and lateral heat paths (through extra-package heat conductors). This segmentation allows the area below the package to be preserved for electrical connections while the lateral paths provide additional heat dissipation capacity through the package sides.
Solution Approach 2:
The extra-package heat conductors serve multiple functions: they provide additional thermal management capacity, extend the heat dissipation area without occupying PCB real estate, and can be integrated with existing package structures. This multi-functionality allows simultaneous improvement of power dissipation while maintaining electrical connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal management by enabling effective heat transfer from high-power devices, improving the performance and reliability of micro devices by allowing for higher power usage without overheating or loss of performance.
Implementation Method 1
The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB
Implementation Method 2
The active cooling device has an inlet port, internal channels and an outlet port configured to flow a heat transfer fluid therethrough
Data Source
AI summary
Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.