Extractor Chamber Exhaust Layout for Wafer Furnace Gas Leakage

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Solution Overview

Problem

Existing semiconductor processing apparatuses face challenges in efficiently managing gas leakage and flow, leading to increased pumping costs and potential safety hazards due to the need for extensive gas removal systems.

Innovation Solution

The apparatus incorporates an extractor chamber surrounding the first exhaust duct, connected to a second exhaust duct, which captures and removes any leaking gases, and includes a gas production unit within the extractor chamber to prevent gas leakage into the apparatus, allowing for a more spacious and efficient process chamber design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a closed cabinet with extractor hood is used to remove leaking gases, then gas leakage is prevented, but pumping costs increase due to extensive gas removal requirements

Engineering Contradiction:
Improvegas leakageVSAvoidpumping costs
Core Design Contradiction:
Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The patent extracts the gas removal function from the main process chamber and implements it locally at potential leakage points through separate extractor chambers. This targeted extraction approach removes only the necessary gases at their source rather than requiring extensive removal from the entire cabinet volume, thereby preventing gas leakage while reducing pumping costs.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces extractor chambers as intermediary structures between the process chamber and the external environment. These extractor chambers serve as intermediate zones that capture and remove leaking gases locally, acting as mediators that prevent gases from entering the main cabinet while avoiding the need for extensive gas removal from the entire system.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the process chamber is designed to accommodate more substrates, then productivity increases, but gas management complexity increases

Engineering Contradiction:
Improvesubstrate processing capacityVSAvoidgas management system
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the gas management system into multiple independent extractor chambers, each responsible for a specific region or potential leakage point. This segmentation allows the system to handle larger substrate capacities without proportionally increasing overall system complexity, as each extractor chamber operates independently and can be designed using standardized configurations.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the need for extensive gas pumping, enhances safety by minimizing gas leakage, and enables processing of a larger number of substrates in a single batch, thereby improving economic efficiency and operational safety.

Implementation Method 1

a heater surrounding the process tube for heating the process chamber

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

an exhaust operably connected to the process chamber to remove gas from the process chamber

Methodology Applied
Scientific EffectGas flow removal: Pressure Gradient

Implementation Method 3

an extractor chamber surrounding the first exhaust duct where it connects to the process chamber and connected to a second exhaust duct to remove gas from the extractor chamber

Methodology Applied
Scientific EffectGas extraction: Suction

Data Source

PatentUS20250389485A1Apparatus for processing a plurality of substrates provided with an extractor chamber
Publication Date: 2025.12.25 ASM IP HLDG BV
  • US20250389485A1 patent drawing

AI summary

An apparatus 1 for processing a plurality of substrates 3 is provided. The apparatus may have a process tube 5 creating a process chamber 7; a heater 9 surrounding the process tube 5; a flange 11 for supporting the process tube; and a door 15 configured to support a wafer boat 17 with a plurality of substrates 3 in the process chamber and to seal the process chamber 7. An exhaust operably connected to the process chamber 7 may be provided to remove gas from the process chamber via a first exhaust duct 19. The apparatus may be provided with an extractor chamber 21 surrounding the first exhaust duct where it connects to the process chamber and connected to a second exhaust duct 23 to remove gas from the extractor chamber.