Extrudable Antistatic Tie Layer for Thermal Dye Transfer

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Solution Overview

Problem

There is a need for enhanced adhesion between supports and substrates and receiving layers in thermal dye transfer systems to prevent delamination, especially under hot and humid conditions, where existing tie layers exhibit poor adhesion and humidity sensitivity.

Innovation Solution

An extruded antistatic tie layer with 5-30% polyether-containing antistatic material in a matrix polymer is used, which absorbs less than 3 weight % of moisture at 80% RH and 70°F, providing improved adhesion and antistatic properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional tie layers are used in thermal dye transfer systems, then the structure provides basic adhesion between layers, but the adhesion deteriorates under hot and humid conditions causing delamination

Engineering Contradiction:
Improveadhesion stabilityVSAvoidhumidity sensitivity
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the chemical composition parameters of the tie layer by incorporating polyether-containing polymers (specifically polyethylene oxide and polypropylene oxide) in controlled amounts (0.1-10% by weight). This compositional parameter change enables the tie layer to maintain adhesion stability while reducing humidity sensitivity, as the polyether components provide moisture resistance without compromising bonding performance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite tie layer material by combining conventional adhesive polymers (such as polyacrylates, polyvinylidene chloride, or carboxymethyl cellulose) with polyether-containing additives. This composite structure leverages the adhesive properties of the base polymer while the polyether component provides humidity resistance, resulting in a tie layer that maintains reliable adhesion under hot and humid conditions

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If antistatic materials are added to improve static protection, then antistatic properties are enhanced, but moisture absorption increases reducing adhesion performance

Engineering Contradiction:
Improvestatic electricity protectionVSAvoidadhesion strength
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent optimizes the concentration parameter of polyether-containing materials to fall within the specific range of 0.1-10% by weight. This precise parameter control provides sufficient antistatic protection through the polar nature of polyether groups while limiting moisture absorption that would compromise adhesion. The controlled dosage ensures the balance between static protection and adhesion maintenance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies polyether-containing materials specifically in the tie layer where antistatic properties are most needed, rather than throughout the entire receiving layer. This localized application provides targeted static electricity protection at the interface between layers while minimizing overall moisture absorption, thereby preserving adhesion strength in the bulk material

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances adhesion between supports and substrates, preventing delamination and providing antistatic protection, even under challenging humidity conditions.

Implementation Method 1

absorbs less than 3 weight % of moisture at 80% RH and 70 F

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

enhancing the adhesion of an image receiving layer to a support or substrate bearing the layer

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS7521173B2Extrudable antistatic tielayers
Publication Date: 2009.04.21 KODAK ALARIS LLC
  • US7521173B2 patent drawing
  • US7521173B2 patent drawing
  • US7521173B2 patent drawing

AI summary

The present invention relates to an extruded imaging element comprising an extruded support bearing an extruded image receiving layer and an extruded antistatic tie layer between the extruded support and the extruded image receiving layer, wherein the extruded tie layer absorbs less than 3 weight % of moisture at 80% RH and 70 F (22.78° C.) comprises 5-30% polyether-containing antistatic material in a matrix polymer, and a method for making the same.