Extruded Heat Pipe Structure for Thin Processor Cooling
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Solution Overview
Problem
Current heat pipe cooling systems for computer processors require separate manufacturing and coupling to cold plates, leading to multiple potential points of failure and increased thickness, which is problematic for mobile applications.
Innovation Solution
The proposed solution involves a direct heat pipe attachment design where heat pipes are integrated into a single, continuous metal part using an extrusion process, eliminating the need for separate cold plates and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat pipes are manufactured separately and coupled to cold plates using solder, then the cooling system can be assembled from modular components, but multiple potential points of failure are introduced and the overall thickness increases
Solution Approach 1:
The patent combines the heat pipe and cold plate into a single integrated component manufactured through extrusion. The heat pipe is formed as an integral part of the cold plate structure, eliminating the need for separate manufacturing and soldering operations. This merging of components directly reduces the number of potential failure points while simplifying the manufacturing process.
2Ease of manufacture
If heat pipes are manufactured separately and coupled to cold plates, then modular assembly is enabled, but the thickness of the cooling apparatus increases which is problematic for mobile applications
Solution Approach 1:
The extrusion process creates a monolithic structure where the heat pipe and cold plate are unified into a single piece. This integration eliminates the additional thickness that would result from separate components and solder joints, while the extrusion process itself enables efficient manufacturing of the integrated structure.
3Reliability
If heat pipes are integrated into a single continuous metal part using extrusion, then thickness is reduced and robustness is enhanced, but the manufacturing process becomes more specialized
Solution Approach 1:
The patent employs extrusion, a specialized manufacturing process that transforms metal stock into a continuous profile with the desired cross-sectional shape. This parameter change in the manufacturing approach enables the creation of integrated, complex geometries that would be difficult to achieve with traditional machining or assembly methods, while producing a robust, seamless structure.
4Ease of operation
If solder joints are used to couple heat pipes to cold plates, then flexible assembly is enabled, but potential points of failure are introduced
Solution Approach 1:
The integration of the heat pipe and cold plate into a single extruded component eliminates solder joints entirely. The seamless construction removes the weak points that solder connections represent, while the design maintains operational flexibility through the inherent properties of the extruded structure and its mounting configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the thickness of the cooling apparatus, enhances robustness by eliminating solder joints, and simplifies the manufacturing process, leading to more efficient and reliable thermal solutions for computer processors.
Implementation Method 1
a heat pipe portion comprising at least one heat pipe
Implementation Method 2
absorb heat emitted from the chip
Data Source
AI summary
Metal is extruded through a feeder plate and an extrusion die to form a heat pipe component that includes a length of pipe and a flange extending outward from the pipe along the length of the pipe. A section of the flange is removed from the extruded heat pipe component, the pipe is sealed and compressed to reduce its thickness and form a heat pipe element for a computing system.