Extruded Heat Sink Fins and Sidewall With Bonded Conductive Layer
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Solution Overview
Problem
Existing methods for manufacturing heat sinks for semiconductor arrangements are costly and require additional steps for heat dissipation enhancement, such as joining material layers, which increase production complexity and costs.
Innovation Solution
A method involving extrusion using a die and punch to form a heat sink with fins and a circumferential side wall, utilizing a detachable connection of a high thermal conductivity material layer to a semi-finished product, eliminating the need for post-processing and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If existing methods for manufacturing heat sinks are used, then heat dissipation functionality is achieved, but production costs increase and manufacturing complexity increases due to additional joining steps
Solution Approach 1:
The patent combines the heat sink body and heat dissipation fins into a single integrated component manufactured through extrusion. The circumferential side wall is formed as an integral part of the extrusion process, eliminating the need for separate joining operations. This merging of components directly reduces production costs and manufacturing complexity by removing multiple processing steps and material joining requirements.
Solution Approach 2:
The extrusion process serves multiple functions simultaneously: it forms the heat sink body, creates the circumferential side wall, and produces the heat dissipation fins in a single operation. This multi-functionality of the manufacturing process reduces the number of separate operations needed, thereby lowering both production costs and manufacturing complexity.
2Temperature
If material layers are joined to enhance heat dissipation, then thermal conductivity improves, but production complexity and costs increase
Solution Approach 1:
The patent applies local quality by using a single metallic material with uniformly distributed properties throughout the heat sink structure. The extrusion process ensures consistent material composition and thermal conductivity across the entire component, eliminating the need for multi-layer material joining while maintaining effective heat dissipation capabilities.
Solution Approach 2:
The patent utilizes a metallic material composition specifically selected for its thermal conductivity properties. The material formulation and extrusion process create a composite structure at the micro level that optimizes heat transfer while maintaining manufacturing simplicity, avoiding the need for joining separate material layers.
3Reliability
If additional joining steps are implemented, then heat sink performance improves, but thermal resistance increases due to interface boundaries
Solution Approach 1:
By merging the heat sink body and side wall into a single extruded component, the patent eliminates interface boundaries that would otherwise create thermal resistance. The continuous material structure ensures optimal thermal conductivity from the base to the heat dissipation fins, improving overall heat sink performance while minimizing energy loss.
4Manufacturing precision
If multiple processing steps are used, then manufacturing precision improves, but productivity decreases
Solution Approach 1:
The extrusion process performs multiple shaping functions in a single operation, creating the heat sink body, circumferential side wall, and heat dissipation fins simultaneously. This multi-functionality maintains manufacturing precision through controlled extrusion parameters while significantly improving productivity by eliminating sequential processing steps.
Solution Approach 2:
The extrusion process prepares the complete heat sink structure in advance with all features formed during the initial manufacturing step. The preliminary formation of the circumferential side wall and fins during extrusion eliminates the need for subsequent machining or assembly operations, thereby enhancing production efficiency without sacrificing dimensional accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a cost-effective production of a heat sink with improved heat dissipation capabilities, reducing thermal resistance and eliminating the need for additional joining steps, thus lowering production costs and enhancing cooling performance.
Implementation Method 1
Pressing the first metallic material of the semi-finished product through the openings of the die by means of the punch to form the fins and into the circumferential groove of the punch to form the circumferential side wall
Implementation Method 2
the material layer is fully bonded to the first metallic material of the semi-finished product
Implementation Method 3
a heat sink for a semiconductor arrangement, which is manufactured by such a flow pressing process
Data Source
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AI summary
The invention relates to a method for producing a heat sink (2) having fins (24) and a peripheral side wall (26) by means of extrusion. To save costs, the following steps are proposed: Providing (A) a die (4) which has a base surface (6) and providing a punch (8) which has a pressure surface (10), the base surface (6) of the die (4) having openings (12) and a peripheral rebate (14) being formed on the pressure surface (10) of the punch (8); inserting (B) a semifinished product (20) made of a first metal material into the die (4); releasably connecting (C) a material layer (22) made of a second metal material, which has a higher thermal conductivity than the first metal material, to the pressure surface (10) of the punch (8); bringing (D) the punch (8) into contact, via the material layer (22), with the semifinished product (20) inserted in the die (4); pressing (E), by means of the punch (8), the first metal material of the semifinished product (20) through the openings (12) in the die (4) to form the fins (24) and into the peripheral rebate (14) of the punch (8) to form the peripheral side wall (26), the entire surface of the material layer (22) being connected to the first metal material of the semifinished product (20) and, as a result of the pressing (E), the heat sink (2) being formed; releasing (F) the punch (8) from the material layer (22); and ejecting (G) the heat sink (2) from the die (4).