One-Piece Extruded Heat Sink for Omnidirectional LED Lamp
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Solution Overview
Problem
Conventional LED lamps face challenges in rapid heat dissipation, leading to potential damage of LED chips, and existing designs are costly, complex to fabricate, and inefficient in transferring waste heat, especially when emitting light in different directions.
Innovation Solution
A one-piece extruded heat sink module with a tubular heat-transfer base, broad platform, and hollow protruding mount, where the radiation fins are radially mounted around the base, allowing for adjustable wall thickness and efficient heat transfer to the outside through the fins, facilitating quick dissipation of waste heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rectangular heat-transfer prism is used to dissipate heat, then heat dissipation is provided, but the solid prism structure cannot rapidly dissipate heat and does not allow wire arrangement, and the cost is high
Solution Approach 1:
The heat sink base is divided into multiple functional segments: a tubular heat-transfer base portion for heat conduction, a broad platform for structural support and wire routing, and a hollow protruding mount for LED chip mounting. This segmentation allows each part to perform its function optimally while simplifying the overall structure compared to a solid prism.
Solution Approach 2:
The heat sink base uses a hollow tubular structure with longitudinal mounting grooves instead of a solid prism. This porous-like structure increases surface area for heat dissipation, allows wires to pass through the tubular chamber, and reduces material usage while maintaining structural integrity.
2Adaptability or versatility
If a heat-transfer base block with separate heat-transfer component is used, then multiple mounting faces are provided, but waste heat cannot be fully and rapidly transferred and heat dissipation efficiency is low, and fabrication is complicated
Solution Approach 1:
The heat sink base integrates multiple functions into a single one-piece extruded component: the tubular heat-transfer base portion conducts heat, the broad platform provides mounting surfaces and wire routing paths, and the hollow protruding mount offers LED chip mounting faces. This merging eliminates the need for separate heat-transfer components while improving heat transfer efficiency through direct thermal contact.
Solution Approach 2:
The one-piece heat sink base serves multiple functions simultaneously: heat conduction through the tubular base, structural support via the broad platform, wire routing through the tubular chamber, and LED chip mounting on the hollow protruding mount. This multi-functionality replaces the need for separate components while improving heat dissipation efficiency.
3Ease of manufacture
If a stretch forming technique heat sink is used, then fabrication is simplified, but it cannot effectively match radiation fins for heat dissipation and wall thickness cannot be adjusted for different LED powers
Solution Approach 1:
The one-piece extruded heat sink base allows different wall thicknesses to be configured in different portions according to the power requirements of LED chips. The extrusion process enables parameter variation within a single component, optimizing heat dissipation effectiveness for different applications while maintaining fabrication simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid and efficient heat dissipation, reducing the risk of LED chip damage and simplifying fabrication by allowing customizable wall thickness and integration of the heat sink components, enhancing the overall performance and cost-effectiveness of omnidirectional LED lamps.
Implementation Method 1
waste heat produced during operation of the LED chips can be rapidly transferred by the hollow protruding mount to the broad platform and the heat-transfer base portion
Implementation Method 2
dissipated into the outside open air by the radiation fins
Implementation Method 3
dissipated into the outside open air by the radiation fins
Data Source
AI summary
An omnidirectional LED lamp holder assembly includes a heat sink module including a heat sink base and radiation fins around the heat sink base, a lampshade and an electrical connector respectively mounted at opposing top and bottom sides of the heat sink module. The heat sink base is a one-piece extruded member defining a tubular heat-transfer base portion, a broad platform and a hollow protruding mount for holding LED chips at different angles. The broad platform horizontally protrudes over the periphery of the tubular heat-transfer base portion, providing a bearing face. The radiation fins are fastened to respective mounting grooves around the periphery of the tubular heat-transfer base portion. Waste heat produced during operation of the LED chips can be rapidly transferred by the hollow protruding mount to the broad platform and the heat-transfer base portion and then dissipated by the radiation fin into the outside open air.