Extrusion Coating for Flat Electronic Component Embedding

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Solution Overview

Problem

Existing methods for housing IC modules and chips face challenges such as sensitivity to handling, uneven surfaces, high temperature and pressure loads, and difficulty in achieving flat surfaces, which compromise the integrity and processing of these components.

Innovation Solution

A method involving extrusion coating where a carrier film with embedded electronic components is coated with a melted extruded material, forming a flat film surface that encloses the components precisely, reducing pressure and temperature stress, and allowing for subsequent lamination without thickness fluctuations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electronic components are attached to a carrier film and covered with laminated films, then the components are protected, but the surface becomes uneven and thick

Engineering Contradiction:

Improveprotection of electronic componentsVSAvoidsurface flatness

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The patent applies extrusion coating to change the physical state of the coating material from solid to molten and back, creating a flat surface that conforms to component contours while maintaining protection

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical lamination process with an extrusion coating process that uses controlled material deposition and thermal processing to achieve surface flatness

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If electronic components are covered with laminated films, then the components are protected, but the process requires high temperature and pressure loads

Engineering Contradiction:

Improveprotection of electronic componentsVSAvoidtemperature and pressure load on components

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent carefully controls and optimizes the temperature and pressure parameters during extrusion coating to provide adequate protection while minimizing thermal and mechanical stress on the electronic components

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent reduces the duration of temperature and pressure exposure by optimizing the extrusion coating process to complete the protective coating application quickly, minimizing the time components are subjected to elevated conditions

Inventive Principle:

Principle #21Skipping (Rushing through)

3Ease of manufacture

If punching holes are provided in the carrier film to accommodate components, then components can be mounted, but registration accuracy cannot be achieved

Engineering Contradiction:

Improvecomponent mountingVSAvoidregistration accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent provides preliminary guidance structures on the carrier film that pre-position components accurately before the extrusion coating process, ensuring proper registration without requiring precise punching

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method produces a composite material with excellent surface quality, optimal protection of electronic components, and the ability to maintain a small thickness, ensuring the components are securely embedded and easily processable without damaging them.

Implementation Method 1

coated with a melted extruded material

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

A method involving extrusion coating where a carrier film with embedded electronic components is coated with a melted extruded material

Methodology Applied

Scientific EffectExtrusion: Extrusion

Implementation Method 3

The coated carrier material is transported further through a nip between two cooling rollers, on which the extruded coating is smoothed, cooled, hardened and connected to the carrier film

Methodology Applied

Scientific EffectCooling: Cooling

Data Source

PatentEP2246173B1Embedding of electronic components using extrusion coating

Publication Date: 2012.06.20 GIESECKEDEVRIENT IP

Figure 1~2b
Figure 3~4a
Figure 4b~7

AI summary

The present invention relates to a composite material (10) comprising at least a first layer (1) of a first material having a first surface (5) and a second surface (5'), at least one component (7, 7') or at least one component group (8) on the first surface (5) of the first layer (1), and a second layer (2) of at least one further material covering the first surface (5) of the first layer (1) and the at least one component (7, 7') or the at least one component group (8), wherein the second layer (2) has a substantially flat surface (6) on its side facing away from the first layer (1). The substantially flat surface (6) of the second layer (2) is achieved by the inventive method for producing the composite material (10), in which the second layer (2) is produced by extrusion coating of the first layer (1) and subsequent smoothing, cooling, and hardening of the second layer (2).The composite material (10) is used in particular as an inlet (30) with electronic components in a chip card structure.