Eyewear Case Heat Sinks for Smart Glasses Thermal Management
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Solution Overview
Problem
Small form factor electronic devices, such as smart glasses, face heat management challenges due to inadequate heat transfer from onboard electronic components, leading to potential component failure and user discomfort from external heating.
Innovation Solution
Implementing internal and external heat conduction pathways, including thermal coupling between the frame and temples, and a case with heat sinks to efficiently transfer heat away from the electronic components, even when the device is in a stowed position, thereby reducing localized heating and enhancing user experience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the form factor of electronic devices is reduced, then the device size and weight are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent extends heat conduction pathways from the traditional two-dimensional surface of wearable devices into the third dimension by incorporating heat-conducting materials within the case structure itself. The case contains internal heat conduction pathways that three-dimensionally distribute and transfer heat away from electronic components, enabling effective heat management in compact form factors.
Solution Approach 2:
The patent introduces heat-conducting materials as intermediary substances between electronic components and the external environment. These materials (such as graphite, metal foils, or heat-conducting polymers) serve as thermal mediators that facilitate heat transfer from hot spots to cooler regions within the case, resolving the heat dissipation challenge in small devices.
2Temperature
If heat conduction pathways are extended into the case, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the protective case structure with heat conduction functionality into a single integrated component. The case is not merely a housing but incorporates heat-conducting materials and pathways as intrinsic features, merging mechanical protection and thermal management functions to avoid increasing overall device complexity.
Solution Approach 2:
The case serves multiple functions simultaneously: it provides mechanical protection for electronic components, acts as a heat sink, and contains integrated heat conduction pathways. This multi-functionality eliminates the need for separate heat dissipation components, maintaining device simplicity while achieving effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat transfer, preventing component failure and user discomfort, while allowing for increased data transfer rates and improved device performance in both wearable and stowed positions.
Implementation Method 1
a first heat conduction pathway thermally coupled to the heat source with the eyewear body disposed on the one or more supports to provide a heat sink for the heat source
Data Source
AI summary
Apparatuses and systems are disclosed and can include a case for eyewear having an eyewear body carrying onboard electronic components that comprise a heat source that generates heat during electrically powered operation is disclosed. The case can hold the eyewear when the eyewear are in a stowed position. The case can further include one or more supports to support the eyewear in the stowed position within the holding space. One or more heat sinks are integrated with the one or more supports. Each of the one or more heat sinks are thermally conductive coupled with a corresponding heat sink of the eyewear. A first heat conduction pathway is thermally connected to the one or more heat sinks and can extend into the case body to conduct heat from the heat source into the case with the eyewear supported in the stowed position.


