Embedded Electrical Components in Fabric Using Flexible Interposers

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Solution Overview

Problem

Incorporating electrical components into fabric-based items is challenging due to the flexibility of fabric, which can damage signal paths when bent or stretched, making it difficult to mount structures securely.

Innovation Solution

The integration of conductive yarns and insulating yarns to form signal paths within the fabric, with electrical components embedded in pockets and electrically coupled to these paths, using interposers with soldered contacts and metal traces to ensure secure connections, and employing flexible printed circuit substrates with serpentine arms for mechanical compliance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electrical components are incorporated into fabric-based items, then enhanced functionality is provided, but the fabric flexibility and signal path integrity deteriorate when bent or stretched

Engineering Contradiction:
ImprovefunctionalityVSAvoidsignal path integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent employs flexible printed circuit boards (FPCBs) as the substrate for mounting electrical components. These FPCBs are designed with serpentine trace patterns that allow the circuit board to flex and stretch with the fabric without damaging the signal paths. The flexible nature of the FPCB maintains electrical connectivity while accommodating the mechanical deformation of the fabric, thus resolving the contradiction between providing enhanced functionality and maintaining signal path integrity during flexing.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent introduces dynamic elements including flexible interposers and serpentine circuit traces that can adapt their shape during fabric deformation. The interposer is designed to flex with the fabric, and the serpentine traces provide mechanical compliance while maintaining electrical connectivity. This dynamic design allows the electrical components to remain functional while the signal paths remain intact during bending and stretching operations.

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If structures are mounted to fabric, then electrical components can be integrated, but the fabric flexibility and mechanical compliance deteriorate

Engineering Contradiction:
Improvecomponent integrationVSAvoidmechanical compliance
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The patent uses flexible printed circuit boards and flexible interposers that maintain the fabric's mechanical compliance while providing structured mounting surfaces for electrical components. These flexible substrates can bend and stretch with the fabric, preserving the soft and flexible characteristics of the original fabric while enabling secure integration of electrical components through standard mounting techniques.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs dynamic mounting solutions where the interposer and circuit board are designed to flex and deform along with the fabric. The serpentine trace patterns and flexible interposer structures allow the mounted components to move and adapt during fabric deformation, maintaining mechanical compliance while ensuring secure component integration.

Inventive Principle:
Principle #15Dynamics

3Strength

If rigid mounting structures are used, then electrical components are securely mounted, but the fabric cannot be bent or stretched without damaging signal paths

Engineering Contradiction:
Improvemounting securityVSAvoidfabric flexibility
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent replaces rigid mounting structures with flexible printed circuit boards and flexible interposers that provide secure electrical connections while accommodating fabric deformation. The serpentine trace patterns on the FPCB and the flexible interposer design ensure that electrical components are securely mounted through soldering and mechanical attachment, while the entire assembly can flex and stretch with the fabric without damaging signal paths.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent introduces dynamic mounting structures where the interposer and circuit board are designed to flex and deform during fabric bending and stretching. The serpentine traces provide mechanical compliance while maintaining secure electrical connections, allowing the mounting structure to adapt to fabric movement while keeping components securely attached.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the seamless incorporation of electrical components into fabric-based items, maintaining the appearance and mechanical compliance of unmodified fabric while enabling enhanced functionality, without damaging the fabric during the incorporation process.

Implementation Method 1

Metal traces in the interposer may couple the contacts to which the electrical device is coupled to the contacts to which the signal paths are coupled

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

A flexible printed circuit substrate layer may have serpentine arms that extend between a main portion of the substrate layer and contact pad support regions

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS11315880B2Fabric with embedded electrical components
Publication Date: 2022.04.26 APPLE INC
  • US11315880B2 patent drawing
  • US11315880B2 patent drawing
  • US11315880B2 patent drawing

AI summary

A fabric-based item may include fabric such as woven fabric having insulating and conductive yarns or other strands of material. The conductive yarns may form signal paths. Electrical components can be embedded within pockets in the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The electrical device may be a light-emitting diode, a sensor, an actuator, or other electrical device. The electrical device may have contacts that are soldered to contacts on the interposer. The interposer may have additional contacts that are soldered to the signal paths. The fabric may have portions that form transparent windows overlapping the electrical components or that have other desired attributes.