Fabric Type Semiconductor Package for Wearable Integration
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Solution Overview
Problem
Conventional semiconductor device packaging methods for wearable computers are inefficient, leading to increased foreign body sensation and reduced productivity due to manual soldering of conductive fibers, making it difficult to integrate portable devices into clothing and automate the process.
Innovation Solution
A fabric type semiconductor device package is developed, comprising a fabric printed circuit board with a patterned conductive lead unit, a semiconductor device with an electrode unit bonded to the lead unit, and a molding unit for sealing, using wire-bonding or flip chip bonding techniques, and integrated with conductive fibers for sewing onto clothing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual soldering of conductive fibers is used to connect semiconductor packages to fabric, then electrical connectivity is achieved, but productivity deteriorates and automation becomes difficult
Solution Approach 1:
The patent replaces manual soldering operations with automated wire bonding technology. The wire bonding process uses automated equipment to deposit conductive material through patterned openings in the fabric, eliminating the need for manual soldering and enabling high-volume automated production of flexible circuit boards integrated with textile substrates.
2Ease of operation
If conventional semiconductor device packaging is used, then device functionality is achieved, but foreign body sensation increases when inserted into clothing
Solution Approach 1:
The patent employs flexible circuit board technology with thin fabric substrates and flexible packaging materials to create semiconductor device packages that conform to clothing surfaces. The flexible nature of the package reduces rigidity and minimizes foreign body sensation, allowing the device to be comfortably integrated into wearable applications while maintaining full device functionality.
3Ease of operation
If conductive fibers are manually connected to semiconductor packages, then electrical wiring is achieved, but installation into clothing becomes inconvenient
Solution Approach 1:
The patent merges the conductive fiber connections with the fabric substrate itself by patterning conductive material directly onto the fabric. This integration eliminates separate connection steps and manual wiring operations, allowing semiconductor packages to be mounted directly onto the patterned fabric using automated processes, thereby improving both installation convenience and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes the foreign body sensation, improves productivity by automating the installation process, and enhances the integration of portable devices into clothing while maintaining electrical connectivity.
Implementation Method 1
The electrode unit of the semiconductor device and the lead unit of the fabric type printed circuit board are wire-bonded to each other
Implementation Method 2
the electrode unit of the semiconductor device and the lead unit of the fabric type printed circuit board are bonded to each other by a flip chip bonding
Implementation Method 3
a molding unit for sealing the fabric type printed circuit board and the semiconductor device
Data Source
AI summary
A fabric type semiconductor device package is provided. The fabric type semiconductor device package comprises a fabric type printed circuit board comprising a fabric and a lead unit formed by patterning a conductive material on the fabric, a semiconductor device comprising an electrode unit bonded to the lead unit of the fabric type printed circuit board, and a molding unit for sealing the fabric type printed circuit board and the semiconductor device. In the fabric type semiconductor device package according to the present invention, a fabric type printed circuit board formed of fabric is used so that a feeling of an alien substance can be minimized. The fabric type semiconductor device package can be easily installed. The productivity of the fabric type semiconductor device package can be improved.