Fabrication Chamber Selection via RF Power Service Phase
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Solution Overview
Problem
The manual determination of fabrication chambers required for different process steps in semiconductor device fabrication is labor-intensive and inefficient, leading to reduced productivity and potential wafer contamination due to the accumulation of deposits in fabrication chambers.
Innovation Solution
A method and device that determine the service phase of radio frequency power time for each fabrication chamber based on its service period, allowing for automated selection of appropriate chambers for target objects to enter in the next process step, thereby improving automation and reducing manpower requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual determination of fabrication chambers is used, then flexibility in chamber selection is maintained, but labor consumption increases and productivity decreases
Solution Approach 1:
The system enables automated self-service by having the fabrication chamber management system automatically determine and assign chambers based on service phases and process requirements, eliminating manual intervention while maintaining optimal selection criteria
Solution Approach 2:
The patent replaces the mechanical manual determination process with an automated computer-based system that uses algorithms to evaluate service phases, RF power times, and process requirements, substituting human labor with automated computational logic
2Productivity
If fabrication chambers are used continuously without frequent cleaning, then productivity is maintained, but wafer contamination risk increases due to deposit accumulation
Solution Approach 1:
The system implements feedback by continuously monitoring the service phase and RF power time accumulation in each fabrication chamber, using this information to determine when cleaning is required and to prevent contamination while optimizing productivity
Solution Approach 2:
The system performs preliminary action by proactively managing chamber service phases and scheduling cleaning operations before contamination occurs, using predictive logic based on accumulated RF power time and service phase data
3Object-affected harmful factors
If frequent cleaning of fabrication chambers is performed, then wafer contamination is reduced, but equipment life is shortened and productivity decreases
Solution Approach 1:
The system uses feedback from service phase monitoring to determine the optimal cleaning frequency, cleaning only when necessary based on actual usage patterns rather than on fixed schedules, thereby extending equipment life while maintaining cleanliness
4Productivity
If automated chamber selection is implemented, then productivity is improved and labor is reduced, but system complexity increases
Solution Approach 1:
The system applies segmentation by dividing the automated chamber selection process into distinct functional modules: service phase determination, RF power time tracking, contamination risk assessment, and chamber assignment logic, making the complex system more manageable and maintainable
Data Source
AI summary
Embodiments of the present disclosure provide a method and a device for determining a fabrication chamber. According to a current radio frequency power time of each of the fabrication chambers corresponding to adjacent process steps and service phases divided based on a service period of the fabrication chambers, a service phase is determined for the current radio frequency power time of each of the fabrication chambers. For target objects processed by the fabrication chambers in the current process step, fabrication chambers for the target objects to enter in a next process step are directly determined according to the service phase of the current radio frequency power time of each of the fabrication chambers.