Fabry-Perot Filter Wafer Cutting with Thinned Mirror Layers
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Solution Overview
Problem
The manufacturing of Fabry-Perot interference filters faces challenges in improving both efficiency and yield due to the complexity of the fine structure involved.
Innovation Solution
A method is introduced that includes forming thinned regions on a wafer, using laser light to create modified regions for precise cutting, and etching to remove sacrificial layers, which enhances manufacturing efficiency and yield by preventing damage and scattering, and includes stress adjustment layers to prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing methods are used for Fabry-Perot interference filters, then the manufacturing process can be completed, but both manufacturing efficiency and yield are low due to the fine structure complexity
Solution Approach 1:
The manufacturing process is segmented into distinct sequential steps: forming the thinned region, creating the modified region via laser irradiation, and then performing cutting. This segmentation allows each step to be optimized independently, improving overall manufacturing efficiency while managing the complexity of the fine structure
Solution Approach 2:
The thinned region is formed in advance before the cutting step. This preliminary thinning of the first mirror layer, sacrificial layer, and second mirror layer along the cutting lines prepares the structure for subsequent laser cutting, enabling precise separation without damaging the fine mirror structures and thereby improving both efficiency and yield
2Manufacturing precision
If laser light is irradiated directly onto the wafer without thinned regions, then cutting can be performed, but scattering of laser light occurs preventing reliable formation of the modified region
Solution Approach 1:
The thinned region is formed in advance before laser irradiation. By removing material from the first mirror layer, sacrificial layer, and second mirror layer along the intended cutting lines, the path for laser light is cleared. This preliminary action prevents scattering and enables reliable formation of the modified region with high precision
Solution Approach 2:
The thinned region acts as an intermediary structure that facilitates laser light transmission. By creating this intermediate thinned zone, the laser light can pass through without scattering from the thicker mirror layers, enabling precise modified region formation for cutting
3Productivity
If the wafer is cut into substrates without forming thinned regions first, then cutting can be performed, but damage occurs to the first mirror layer, sacrificial layer, and second mirror layer
Solution Approach 1:
The thinned region is formed in advance before the cutting operation. This preliminary thinning reduces the thickness of the mirror layers along the cutting lines, allowing the crack to propagate cleanly through the wafer without causing damage to the mirror structures. This enables efficient manufacturing while maintaining layer integrity and improving yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves manufacturing efficiency and yield by ensuring precise cutting and reducing damage to the layers, allowing for the production of high-quality Fabry-Perot interference filters with enhanced stability and reduced defects.
Implementation Method 1
a modified region within the wafer along each of the lines is formed through irradiation of a laser light
Implementation Method 2
extending a crack in a thickness direction of the wafer from the modified region
Data Source
AI summary
A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.