Fabry-Perot Filter Wafer Thinning for Precise Laser Cutting
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Solution Overview
Problem
Manufacturing Fabry-Perot interference filters is challenging due to low efficiency and yield, as they are delicate structures.
Innovation Solution
A method involving forming thinned regions on a wafer, cutting with laser light, and etching to create substrates, which includes forming a first mirror layer, sacrificial layer, and second mirror layer, with partial thinning to prevent damage and improve yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing methods are used for Fabry-Perot interference filters, then the manufacturing process can be completed, but manufacturing efficiency and yield are low due to the delicate structure
Solution Approach 1:
The patent applies preliminary action by forming thinned regions in the mirror layers and sacrificial layer before the cutting step. This pre-thinning prevents damage during subsequent laser cutting and etching operations, thereby improving both manufacturing efficiency and yield. The thinned regions are created through selective removal of material prior to the critical cutting process.
2Manufacturing precision
If laser light is used to cut the wafer, then cutting precision can be achieved, but laser scattering occurs which prevents reliable formation of the modified region
Solution Approach 1:
The patent applies preliminary action by forming thinned regions in the mirror layers before laser cutting. These thinned regions reduce material density and thickness, allowing laser light to pass through with minimal scattering. This enables reliable formation of the modified region and precise cutting without the harmful scattering effect.
3Productivity
If the wafer is cut into multiple substrates, then production quantity increases, but damage occurs to the mirror layers and sacrificial layer during cutting
Solution Approach 1:
The patent applies preliminary action by creating thinned regions in the mirror layers and sacrificial layer before the cutting step. This pre-thinning reduces the mechanical strength and thickness of these layers at the cut lines, allowing the laser to cut through without causing damage to the remaining intact portions of the layers. This enables high-volume production while maintaining layer integrity.
Solution Approach 2:
The patent applies local quality by creating thinned regions only at specific locations where cutting will occur, while leaving the rest of the mirror layers and sacrificial layer at their original thickness. This localized modification provides the necessary cutting accessibility without compromising the overall structural integrity and functionality of the filter components.
4Manufacturing precision
If the gap is formed by removing the sacrificial layer, then the Fabry-Perot structure is created, but damage may occur to the mirror layers during the removing process
Solution Approach 1:
The patent applies preliminary action by forming thinned regions in the mirror layers before the sacrificial layer removal step. This pre-thinning creates a buffer zone that protects the mirror layers from damage during the subsequent etching process. The thinned regions allow the etchant to access and remove the sacrificial layer without transmitting excessive mechanical or chemical stress to the mirror layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances manufacturing efficiency and yield by preventing laser scattering and damage during cutting, allowing for precise formation of gaps and layers.
Implementation Method 1
a modified region within the wafer along each of the lines is formed through irradiation of a laser light
Implementation Method 2
scattering or the like of a laser light is prevented so that the modified region can be reliably formed within the wafer
Data Source
AI summary
A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.