Face-to-Face Bonding Pads for Compact 3D Chip Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in reducing the physical size of semiconductor chips while maintaining integration density, as traditional packaging techniques are inefficient and costly, especially when integrating semiconductor dies from different foundries.
Innovation Solution
A 3D integrated circuit structure is developed, where semiconductor dies are stacked and bonded using hybrid bonding techniques, with through vias and micro bumps for electrical coupling, allowing for reduced footprint and cost-effective assembly by aligning and bonding pads on the dies, and employing dielectric and conductive materials for interconnect structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional packaging techniques are used to integrate semiconductor dies, then the integration process is simple, but the packaging cost is high and the footprint is large
Solution Approach 1:
The patent transitions from traditional planar packaging to three-dimensional stacked packaging, where semiconductor dies are arranged vertically in multiple layers and bonded together through micro bumps and through vias. This dimensional change reduces the footprint area while maintaining integration density, directly resolving the contradiction between small footprint and manufacturing simplicity.
2Adaptability or versatility
If semiconductor dies from different foundries are integrated using traditional methods, then compatibility issues arise, but the patent enables multi-foundry integration through standardized bonding interfaces
Solution Approach 1:
The patent creates universal bonding interfaces with standardized pad layouts and dimensions that can accommodate semiconductor dies from different foundries. The hybrid bonding technique with micro bumps and through vias provides a standardized connection method that ensures reliable electrical and mechanical coupling across multi-foundry integrations, resolving both adaptability and reliability requirements.
3Quantity of substance
If minimum feature size is continuously reduced to increase integration density, then more components fit in a given area, but manufacturing precision requirements increase
Solution Approach 1:
Instead of continuing to reduce minimum feature size in the planar dimension, the patent increases integration density by stacking dies in the vertical dimension. This approach allows more components to be integrated by adding layers rather than shrinking individual features, thereby reducing the pressure for extreme manufacturing precision while achieving higher integration density.
Data Source
AI summary
A device comprises a first chip comprising a first connection pad embedded in a first dielectric layer and a first bonding pad embedded in the first dielectric layer, wherein the first bonding pad comprises a first portion and a second portion, the second portion being in contact with the first connection pad and a second chip comprising a second bonding pad embedded in a second dielectric layer of the second chip, wherein the first chip and the second chip are face-to-face bonded together through the first bonding pad the second bonding pad.