Face-Down Plating Apparatus with Resistor Body for Bubble-Free Contact
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Solution Overview
Problem
Face-down plating apparatuses with a resistor body between the substrate and anode face challenges in achieving uniform plating due to air bubble intrusion and temperature regulation issues, particularly in narrow spaces, leading to non-uniform film thickness and potential stagnation of the plating solution.
Innovation Solution
The method involves positioning a resistor body above the anode with a plating solution flowing along its upper surface from the periphery to the center, creating a raised portion, allowing the substrate to be lowered and make contact with the plating solution without air bubbles, and utilizing a plating solution circulation and cooling mechanism to regulate temperature and ensure uniform coverage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an upward flow of plating solution is created to remove air bubbles, then air bubbles can be forced out of the substrate, but the resistor body blocks the upward flow preventing the formation of a raised liquid surface
Solution Approach 1:
Instead of creating an upward flow from the bottom of the plating cell as in conventional methods, the patent inverts the approach by creating a downward flow from above the resistor body. The plating solution flows downward along the front surface of the resistor body, naturally pushing air bubbles upward and outward from the substrate without being blocked by the resistor body structure.
2Manufacturing precision
If the resistor body is disposed at a small distance from the substrate to enhance in-plane uniformity, then current pathways are controlled through the resistor body, but the plating solution cannot flow smoothly in the narrow space without stagnation
Solution Approach 1:
The patent applies local quality by creating different flow conditions in different regions. The plating solution flows downward along the front surface of the resistor body where space is limited, while in the rear region behind the resistor body, the solution flows in a more open space. This localized flow management ensures smooth solution delivery to the substrate while maintaining the narrow resistor-substrate spacing needed for uniformity.
3Productivity
If the substrate is lowered to bring the surface to be plated into contact with the plating solution, then plating can be carried out, but air bubbles intrude into the interface causing non-contact portions and non-uniform plating
Solution Approach 1:
The patent applies preliminary action by pre-flowing the plating solution downward along the front surface of the resistor body before the substrate makes contact with the main plating solution body. This preliminary flow establishes a bubble-free interface region, ensuring that when the substrate is lowered, no air bubbles intrude into the plating interface, thus maintaining uniform plated film quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform plating by preventing air bubble intrusion and enhancing in-plane uniformity of the plated film thickness while effectively regulating the plating solution temperature, even in narrow spaces, thus improving the overall plating process efficiency.
Implementation Method 1
allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body, thereby creating a raised portion of the plating solution in the center of the upper surface of the resistor body
Implementation Method 2
carrying out plating of a downwardly-facing surface to be plated of a substrate by applying a voltage between the surface to be plated and an anode disposed below the substrate in the presence of a plating solution
Implementation Method 3
the resistor body produces heat when applying current on plating, causing a rise of the temperature of the plating solution
Data Source
AI summary
A plating method, employing a face-down manner of plating and using a resistor body between a substrate and an anode, can securely bring an entire surface to be plated of the substrate into contact with a plating solution without permitting intrusion of air bubbles to the surface to be plated. A resistor body is disposed above the anode and immersed in the plating solution, allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body. Thus, a raised portion of the plating solution is created in the center of the upper surface of the resistor body. The substrate is then lowered with the surface facing downwardly so as to fill the space between the surface to be plated of the substrate and the upper surface of the resistor body with the plating solution.