Faceplate Heating Element and Cantilever Support for High Temperature Deposition
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Solution Overview
Problem
Current substrate processing chamber components lack effective temperature control, which is crucial for defect-free semiconductor device fabrication, particularly in processes like chemical vapor deposition and atomic layer deposition.
Innovation Solution
A faceplate design for processing chambers featuring a heating element surrounded by apertures, a support ring with a cantilever for structural support, and strategically placed gaps to limit heat transfer, allowing for high-temperature operation while minimizing droop and maintaining sealing integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the faceplate is heated to high temperatures for deposition processes, then deposition uniformity and process control are improved, but excessive heat transfer to seals causes droop and sealing failure
Solution Approach 1:
The faceplate is divided into distinct thermal zones using thermal chokes and support ring structures. The heating element is segmented into multiple sections with independent temperature control, allowing different regions to operate at different temperatures. This segmentation prevents uniform heat distribution that would cause excessive heat transfer to seals while maintaining necessary high temperatures in deposition regions.
Solution Approach 2:
Thermal chokes are introduced as intermediary structures between the heated faceplate and the seals. These thermal chokes act as thermal barriers that mediate heat transfer, allowing the faceplate to maintain high temperatures while preventing excessive heat from reaching the seals. The support ring with cantilever structure also serves as an intermediary mechanical support that minimizes thermal conduction paths to seals.
2Temperature
If the heating element is positioned close to the substrate for efficient heating, then temperature control is improved, but particle deposition on the faceplate increases
Solution Approach 1:
Different regions of the faceplate are given different local qualities through selective heating zones. The heating element creates localized high-temperature regions directly over the substrate while maintaining lower temperatures in peripheral areas where particle deposition is problematic. This local quality differentiation allows efficient substrate heating while minimizing particle deposition on faceplate surfaces.
Solution Approach 2:
The temperature parameter is dynamically changed across different spatial locations and time periods during the deposition process. The system employs programmable temperature profiles that adjust heating intensity in different zones, maintaining high temperatures where needed for deposition while reducing temperatures in areas prone to particle accumulation, thereby controlling both temperature efficiency and particle deposition.
3Strength
If the support ring contacts the faceplate body for structural support, then mechanical stability is improved, but heat transfer to seals increases
Solution Approach 1:
The support ring design extracts and isolates the thermal conduction path from the mechanical support function. The cantilever structure is positioned and dimensioned to provide necessary mechanical support while minimizing thermal contact area with the faceplate body. This extraction separates the structural support function from heat transfer, allowing stable mechanical support with reduced thermal energy loss to seals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables the faceplate to reach high temperatures (above 350°C) with reduced particle deposition, enhancing substrate processing uniformity and tool uptime by controlling temperature and minimizing heat transfer to seals.
Implementation Method 1
a heating element disposed within the body, the heating element circumscribing the plurality of apertures
Implementation Method 2
Thermal chokes limit heat transfer
Data Source
AI summary
Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.