Faceted Drain-Side ReRAM Electrode for Neuromorphic Computing

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Solution Overview

Problem

Resistive random access memory (ReRAM) devices face challenges in controlling the position of current conducting filaments during electroforming, leading to higher forming voltages and device variability as they are scaled, particularly in oxide ReRAMs and bipolar ReRAMs required for neuromorphic computing.

Innovation Solution

A resistive random access memory stack is formed on a faceted drain-side structure of a semiconductor-on-insulator substrate, utilizing a drain-side metal semiconductor alloy as the bottom electrode, which enhances the formation of current conducting filaments and reduces variability by providing a controlled environment for resistance state updates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electroforming is used to form current conducting filaments in oxide ReRAM, then the ReRAM can achieve resistance state switching, but the filament position is not well controlled resulting in higher forming voltage and higher device variability

Engineering Contradiction:
Improvedevice variabilityVSAvoidforming voltage
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent applies local quality by creating a faceted structure with specific crystallographic orientations at the drain-side interface. This localized structural modification provides preferential sites for filament formation, ensuring that filaments form at specific locations rather than randomly throughout the oxide layer. The faceted structure with defined surface orientations creates locally favorable conditions for controlled filament nucleation and growth.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The faceted structure is formed beforehand through selective epitaxial growth before the electroforming process. This preliminary action prepares the interface with specific crystallographic facets that will guide subsequent filament formation. By pre-establishing the structural template, the patent ensures that when electroforming occurs, the filaments will form at predetermined locations with controlled positions, reducing variability and forming voltage.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If ReRAM is scaled down to smaller dimensions, then device density increases, but filament position control becomes more difficult leading to higher forming voltage

Engineering Contradiction:
Improvedevice densityVSAvoidfilament position control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The faceted structure creates localized regions with specific surface orientations that serve as predetermined filament formation sites. Even as device dimensions are reduced, these local structural features maintain their ability to guide filament formation, ensuring consistent position control across different scaling regimes. The local crystallographic quality provides a robust template that is less sensitive to overall device size reduction.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces a new dimension of control by utilizing crystallographic orientation and surface facet geometry rather than relying solely on planar dimensional control. The faceted structure adds vertical and angular dimensions to the filament formation process, creating a three-dimensional template that guides filament positioning. This dimensional approach provides more precise control as devices are scaled to smaller lateral dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If bipolar ReRAM is used for neuromorphic computing, then resistance state updates in both directions are enabled, but the requirement for precise filament control increases device complexity

Engineering Contradiction:
Improveneuromorphic computing capabilityVSAvoidfilament control mechanism
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The faceted structure with specific crystallographic orientations creates localized regions that facilitate bidirectional filament formation and dissolution. The different surface facets can preferentially support cation migration in opposite directions, enabling both SET and RESET operations through controlled electrochemical reactions at specific interface locations. This local structural differentiation simplifies the control mechanism for bipolar operation.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The faceted structure inherently provides the control mechanism needed for bipolar operation through its crystallographic geometry. The specific surface orientations self-organize to create favorable pathways for cation migration during both forming and switching operations. This self-organizing structural template reduces the need for additional control elements or complex external control mechanisms, as the structure itself guides the bidirectional filament dynamics required for neuromorphic computing.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for more controlled and efficient formation of current conducting filaments, reducing the forming voltage and device variability, thereby improving the scalability and performance of ReRAM devices, especially for neuromorphic computing applications.

Implementation Method 1

a faceted drain-side structure of a functional gate structure that is located on a topmost surface of a fully depleted semiconductor channel material layer

Methodology Applied
Scientific EffectField enhancement: Electric Field

Data Source

PatentUS10374039B1Enhanced field bipolar resistive RAM integrated with FDSOI technology
Publication Date: 2019.08.06 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US10374039B1 patent drawing
  • US10374039B1 patent drawing
  • US10374039B1 patent drawing

AI summary

A resistive random access memory stack is formed on a surface of a faceted drain-side structure that is present on one side of a functional gate structure. The functional gate structure and the faceted drain-side structure are located on a topmost surface of a fully depleted semiconductor channel material layer. In some embodiments, the resistive random access memory stack includes a bottom electrode, a resistive switching layer and a top electrode. In other embodiments, the resistive random access memory stack includes a resistive switching layer and a top electrode. In such an embodiment, a drain-side metal semiconductor alloy of the faceted drain-side structure is used as the bottom electrode of the resistive random access memory device.