Faceted Optical Interposer for Integrated Optical-Electrical Links
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical components efficiently for signal transmission and processing, particularly in forming devices that combine long-range optical components with short-range electrical components, leading to inefficiencies in signal conversion and processing.
Innovation Solution
The development of an optical interposer that incorporates facet structures to facilitate optical interconnects, utilizing a silicon-on-insulator substrate with layered optical components and metallization layers, and bonding semiconductor devices for efficient electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical and electrical components are integrated in separate packages, then each component can be optimized independently, but signal conversion and processing efficiency deteriorates due to additional interfaces and alignment requirements
Solution Approach 1:
The patent merges optical and electrical components into a single integrated device structure. The optical waveguide layer is directly combined with electrical contact layers and semiconductor layers on the same substrate, eliminating the need for separate optical and electrical packages. This integration enables direct signal conversion between optical and electrical domains without additional interfaces, thereby improving signal conversion efficiency while maintaining manageable device complexity through a unified design approach.
2Length of moving object
If optical components are used for long-range signal transmission, then transmission distance is improved, but device complexity increases due to the need for separate optical components
Solution Approach 1:
The patent combines optical waveguide structures with electrical signal processing components in a single integrated device. The optical waveguide layer is formed on the substrate and directly integrated with electrical contact layers and semiconductor layers, allowing long-range optical signal transmission to be achieved without requiring separate optical components. This merging approach maintains transmission distance capabilities while reducing overall device complexity.
3Power
If electrical components are used for short-range signal transmission and processing, then processing capability is improved, but signal conversion efficiency deteriorates when interfacing with optical components
Solution Approach 1:
The patent integrates electrical contact layers and semiconductor layers directly with the optical waveguide structure on the same substrate. This merging enables direct optical-to-electrical and electrical-to-optical signal conversion within the integrated device, eliminating inefficiencies associated with interfacing separate optical and electrical components. The direct integration maintains signal processing capability while improving signal conversion efficiency.
Data Source
AI summary
Optical devices and methods of manufacture are presented in which optical interposers are formed with facets. In some embodiments a method includes receiving a first optical interposer bonded to a first semiconductor device, attaching a support substrate to the first semiconductor device, forming a facet recess to recess a sidewall of the first optical interposer and expose the support substrate, and forming a first spacer along a sidewall of the first optical interposer after the forming the facet recess.