Thermally Protective Structure With Faceted Surface For Heat Dissipation

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Solution Overview

Problem

Conventional thermal management techniques for media communication devices, such as set-top boxes, are hindered by the need for reduced volume and the absence of vents, making it difficult to dissipate heat effectively without increasing the device's size or compromising surface area.

Innovation Solution

A thermally protective structure with a plurality of structural feature formations on its outer surface, such as wedge-shaped or pyramid-shaped facets, increases the surface area for heat dissipation while maintaining the same volume, allowing for enhanced heat transfer and reduced touch temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermal management techniques (heat sinks, fans, vents) are used, then heat dissipation is improved, but device volume increases or surface area is reduced

Engineering Contradiction:
Improveheat dissipationVSAvoiddevice volume
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The patent applies micro-scale surface modifications to the case exterior, transitioning from a flat 2D surface to a 3D textured surface with raised and recessed features. This dimensional change increases the effective surface area for heat dissipation without increasing the overall device volume, as the thermal management function is embedded in the existing case surface rather than adding separate heat sinks or fans.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If conventional thermal management techniques (heat sinks, fans, vents) are used, then heat dissipation is improved, but surface area for heat transfer is reduced

Engineering Contradiction:
Improveheat dissipationVSAvoidsurface area
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The case surface is segmented into multiple micro-scale features (raised portions and recessed portions) that collectively increase the surface area. Instead of a single flat surface, the case is divided into numerous small thermal elements that provide enhanced heat transfer area while maintaining the same footprint.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transforms the 2D case surface into a 3D textured surface with vertical elements (raised and recessed portions), thereby increasing the surface area available for heat dissipation without expanding the device's external dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If the case surface is modified to increase surface area, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidcase structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the structural case function with the thermal management function by integrating surface modifications directly into the case itself. The case serves dual purposes: providing mechanical protection and enabling heat dissipation through its textured surface, thereby avoiding the need for separate thermal management components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The case is designed with multi-functionality, serving both as a protective enclosure and as a thermal management component. The textured surface features perform dual roles in maintaining structural integrity and enhancing heat dissipation, reducing overall device complexity by eliminating dedicated thermal management parts.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively increases the surface area for heat dissipation by up to 20.78% without altering the device's volume, reducing the risk of overheating and ensuring compliance with touch temperature regulatory criteria.

Implementation Method 1

a thermally protective structure that is a case or enclosure for a media communication device... The thermally protective structure has a plurality of structural feature formations with facets constructed in or on its outer surface to increase the surface area through which heat is dissipated

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

the processor generates heat that transfers into the case and dissipates from the outer surface of the case

Methodology Applied
Scientific EffectHeat dissipation: Convection

Data Source

PatentUS12058842B2Method and system for small scale structures to improve thermal efficiency
Publication Date: 2024.08.06 ARRIS ENTERPRISES LLC
  • US12058842B2 patent drawing
  • US12058842B2 patent drawing
  • US12058842B2 patent drawing

AI summary

Embodiments relate to a thermally protective structure that is a case or enclosure for a media communication device (e.g., a set-top box). The thermally protective structure has a plurality of structural feature formations with facets constructed in or on its outer surface to increase the surface area through which heat is dissipated.