Facing Target Sputtering for OLED Encapsulation
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Solution Overview
Problem
The existing sputtering methods for manufacturing organic light-emitting display apparatuses can physically damage the organic or inorganic layers due to high-energy secondary electrons and particles, leading to deterioration of OLED characteristics.
Innovation Solution
A facing target sputtering apparatus is used to form a plasma surface process and an encapsulation layer with a low temperature viscosity transition (LVT) inorganic substance, such as tin oxide, where the induced magnetic field coil generates high-density plasma that minimizes damage and improves surface adhesion, and an annealing process is performed to remove defects and enhance the encapsulation layer's density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional sputtering method is used to form encapsulation layer, then film formation efficiency is improved, but organic light-emitting layer is physically damaged by high-energy particles
Solution Approach 1:
The patent converts the harmful high-energy particles from conventional sputtering into beneficial low-energy plasma ions by using a facing target configuration. The plasma generated between the facing targets provides sufficient ionization for film formation while the reduced particle energy prevents damage to the organic light-emitting layer, thus converting a harmful effect into a beneficial one.
Solution Approach 2:
Instead of using a single target that fires particles directly at the substrate (conventional method), the patent inverts the approach by using two facing targets that generate plasma between them. This inversion changes the mechanism from direct particle bombardment to plasma-mediated deposition, reducing physical damage while maintaining film formation efficiency.
2Strength
If high-energy plasma is used for surface processing, then surface adhesion is improved, but organic layer is damaged
Solution Approach 1:
The patent changes the energy parameters of the plasma by using a facing target sputtering apparatus. The plasma generated in this configuration has lower particle energy compared to conventional methods, allowing surface processing that improves adhesion without causing damage to the organic light-emitting layer. The parameter change in plasma energy enables simultaneous achievement of both adhesion improvement and layer protection.
3Device complexity
If conventional sputtering is used, then manufacturing process is simple, but OLED characteristics deteriorate
Solution Approach 1:
The patent inverts the conventional sputtering configuration to use facing targets, which fundamentally changes the plasma generation mechanism. This inversion reduces particle energy and prevents OLED characteristic deterioration while maintaining reasonable manufacturing process complexity. The facing target configuration becomes a practical solution that balances process simplicity with device reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage to the organic light-emitting layers, improves the encapsulation characteristics, and forms a dense encapsulation layer that protects the OLED from external environments while maintaining the integrity of the organic light-emitting display apparatus.
Implementation Method 1
forming a pre-encapsulation layer for encapsulating the organic light-emitting portion by using a facing target sputtering apparatus
Implementation Method 2
forming an encapsulation layer by performing a plasma surface process on the pre-encapsulation layer by using the facing target sputtering apparatus
Implementation Method 3
an induced magnetic field coil arranged to surround the exterior of the chamber
Implementation Method 4
an annealing process is performed to remove defects and enhance the encapsulation layer's density
Data Source
AI summary
A method of manufacturing an organic light-emitting display apparatus includes preparing a deposition target in which an organic light-emitting portion is formed on a substrate, forming a pre-encapsulation layer for encapsulating the organic light-emitting portion by using a facing target sputtering apparatus, and forming an encapsulation layer by performing a plasma surface process on the pre-encapsulation layer by using the facing target sputtering apparatus. The facing target sputtering apparatus includes a chamber in which a mounting portion for accommodating the deposition target is provided, a gas supply portion facing the mounting portion and supplying gas to the chamber, a first target portion and a second target portion disposed in the chamber and facing each other, and an induced magnetic field coil surrounding the exterior of the chamber.