Factory Interface Vacuum Ejectors Without Direct Pump Piping
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Solution Overview
Problem
Existing semiconductor processing systems face inefficiencies and higher costs due to the need for direct connections to vacuum pumps at factory interfaces (FIs), which increase piping, wiring, and maintenance requirements.
Innovation Solution
Implementing a system that uses clean dry air (CDA) operated vacuum ejectors to provide vacuum to FIs, eliminating the need for a direct connection to a vacuum pump, thereby reducing capital and operating costs and simplifying the FI design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum pumps are directly connected to factory interfaces, then vacuum supply is reliable, but device complexity and maintenance requirements increase
Solution Approach 1:
The vacuum pump is extracted from the factory interface location and placed in a remote location. The vacuum ejector at the factory interface generates vacuum locally using clean dry air, eliminating the need for direct vacuum pump connection and associated piping and wiring at the factory interface.
Solution Approach 2:
The vacuum ejector acts as an intermediary device between the clean dry air supply and the factory interface vacuum requirement. It converts clean dry air into vacuum pressure, serving as a mediator that eliminates the need for direct vacuum pump connection.
2Reliability
If vacuum pumps are directly connected to factory interfaces, then vacuum supply is reliable, but operating costs and maintenance needs increase
Solution Approach 1:
The vacuum pump is extracted from the factory interface location, eliminating the need for maintenance activities at the factory interface. The vacuum ejector uses clean dry air which is already available in the facility, reducing operating costs and maintenance needs.
3Reliability
If vacuum pumps are directly connected to factory interfaces, then vacuum supply is established, but capital costs increase
Solution Approach 1:
The vacuum pump is extracted from the factory interface requirement, eliminating capital expenditure for vacuum pump installation, piping, and wiring at the factory interface. The system leverages existing clean dry air infrastructure already present in semiconductor fabrication facilities.
Solution Approach 2:
The clean dry air system, already universally present in semiconductor facilities for other purposes, is repurposed to generate vacuum at factory interfaces. This multi-functional use of existing infrastructure reduces capital costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces capital and operating costs by eliminating the need for vacuum pump connections, enhancing efficiency and reducing maintenance needs while maintaining effective vacuum supply for substrate processing.
Implementation Method 1
vacuum ejectors operable to provide vacuum to a factory interface using clean dry air
Data Source
AI summary
A system operable for transporting semiconductor substrates includes a factory interface. The system further includes one or more robots disposed within the factory interface. The system further includes a vacuum ejector operable to provide vacuum to the factory interface.