Fail Bit Repair via Recursive Redundant Circuit Allocation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current redundant circuit allocation methods for repairing Fail Bits (FBs) in integrated circuit chips are non-optimal, leading to incomplete repair of FBs and high chip scrap rates due to limited repair ranges and inefficient allocation of Redundant Bit-Lines (RBLs) and Redundant Word-Lines (RWLs.

Innovation Solution

The proposed method involves determining a bank to be repaired, performing initial compression processing to reduce the number of bits, dividing the bank into target repair regions, and using a recursive FB position determination step to identify and repair unrepaired FBs using redundant circuits, optimizing the allocation of RBLs and RWLs for effective FB repair.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If redundant circuits are allocated using conventional methods, then repair processing can be performed, but the allocation is non-optimal leading to incomplete repair of FBs

Engineering Contradiction:
ImproveFB repair completenessVSAvoidredundant circuit allocation complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the bank to be repaired into multiple target repair regions, and further divides each target repair region into multiple sub-regions. This segmentation allows for systematic identification and repair of FBs in different regions using different allocation modes (first allocation mode for initial repair, second allocation mode for remaining FBs), ensuring complete repair while managing complexity through structured division of the repair task.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary compression processing on the bank to be repaired before dividing it into target repair regions. This preliminary action reduces the data size and simplifies subsequent processing. Additionally, the method determines FB positions in advance through testing before allocating redundant circuits, allowing for optimized repair strategies to be applied systematically.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If conventional FB repair methods are used, then some FBs can be repaired, but chip scrap rates are high due to limited repair ranges

Engineering Contradiction:
Improvechip repair yieldVSAvoidrepair effectiveness
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent employs a universal repair framework that can handle different types of FBs through multiple allocation modes. The first allocation mode repairs FBs in specific regions, while the second allocation mode handles remaining FBs, creating a multi-functional repair system that maximizes the utilization of redundant circuits across the entire chip, thereby increasing repair yield without sacrificing effectiveness.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent implements a dynamic repair process where the allocation mode changes based on the repair progress. Initially, the first allocation mode is used to repair FBs in target repair regions, then the second allocation mode is applied to repair remaining FBs. This dynamic adaptation of repair strategies ensures maximum repair effectiveness while systematically addressing all FBs on the chip.

Inventive Principle:
Principle #15Dynamics

3Reliability

If more redundant circuits are used to repair all FBs, then repair completeness improves, but repair costs increase

Engineering Contradiction:
ImproveFB repair completenessVSAvoidredundant circuit consumption
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent changes the allocation parameters of redundant circuits based on the repair progress and FB distribution. By adjusting which allocation mode is applied to which region, the method optimizes the utilization of available redundant circuits, ensuring complete FB repair while minimizing the consumption of redundant circuit resources through intelligent parameter adjustment rather than simply increasing resource quantity.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11887685B2Fail Bit repair method and device
Publication Date: 2024.01.30 CHANGXIN MEMORY TECH INC
  • US11887685B2 patent drawing
  • US11887685B2 patent drawing
  • US11887685B2 patent drawing

AI summary

A Fail Bit (FB) repair method and device can be applied to repairing an FB in a chip. The method includes: a bank to be repaired including multiple target repair regions in a chip to be repaired is determined; first repair processing is performed on a first FB in each target repair region by using a redundant circuit; a second FB position determination step is executed to determine a bit position of a second FB, and second repair processing is performed on the second FB; unrepaired FBs in each target repair region is determined, and the second FB position determination step is recursively executed to obtain a test repair position of each unrepaired FB to perform third repair processing on the unrepaired FB according to the test repair position.