Fail Signature Database for IC Systematic Defect Detection
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Solution Overview
Problem
Integrated circuit (IC) chip manufacturing faces challenges in meeting yield goals during early production runs due to the failure to identify systematic defects resulting from new layout topologies and foundries that do not comply with process design kit (PDK) specifications, leading to low yield and waste.
Innovation Solution
A method for developing a fail signature database before production runs, which stores fail signatures and root causes of systematic defects identified in prototype chips, allowing for prevention and early detection of similar defects in production chips through design and process adjustments, and in-line advanced process control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If production chips are manufactured using new layout topologies and foundries without prior testing, then productivity increases, but manufacturing precision deteriorates due to undetected systematic defects
Solution Approach 1:
The patent creates a fail signature database during prototype development before production manufacturing begins. This preliminary action captures systematic defects and their signatures in advance, enabling detection during production without slowing down the manufacturing process. The database is built using prototype chips that are intentionally subjected to varied process specifications to expose potential defects before full-scale production.
Solution Approach 2:
The patent performs in-line advanced process control (APC) inspections during production manufacturing to detect systematic defects in real-time. By comparing production chip signatures against the pre-built fail signature database, the system can identify and flag defective chips immediately during production, preventing defective products from reaching customers while maintaining high production rates.
2Manufacturing precision
If systematic defects are identified during production runs, then manufacturing precision improves, but loss of time increases due to post-production detection
Solution Approach 1:
The patent implements in-line advanced process control inspections that occur during the manufacturing process itself, skipping the traditional post-production testing phase. By integrating defect detection into the production flow, the system identifies systematic defects in real-time without adding time to the overall manufacturing cycle, allowing immediate corrective actions to be taken.
3Manufacturing precision
If in-line advanced process control is implemented during production runs, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The patent uses a fail signature database that stores characteristic patterns of systematic defects identified during prototype development. During production, the inspection system compares chip measurements against these pre-stored failure patterns rather than using complex real-time analysis algorithms. This copying approach simplifies the production inspection system while maintaining high defect detection accuracy.
Data Source
AI summary
Disclosed are embodiments of a method that provides for pre-production run development of a fail signature database, which stores fail signatures for systematic defects and corresponding root causes. The fail signatures in the database is subsequently accessed and used for a variety of purposes. For example, the fail signatures are evaluated and, based on the results of the evaluation, actions are taken to prevent specific systematic defects from occurring during production runs and/or to allow for early detection of specific systematic defects during production runs. In some embodiments, following production runs, new fail signatures from failing production chips are developed and compared against the fail signatures in the fail signature database. In some embodiments, when a signature match indicates that a particular production chip has a same systematic defect with a same root cause as a particular prototype chip in-line advanced process control (APC) is performed.