Fan Assembly Airflow Shaping for Server Cooling in Tight Rack Space
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Solution Overview
Problem
Current air cooling systems for computer servers are inadequate for high-performance SoC systems due to limited airflow enhancement and size constraints, while liquid cooling is complex and costly.
Innovation Solution
A fan accessory and assembly with specialized air-inlet and air-outlet pieces that gradually vary in diameter to compress and expand airflow, enhancing cooling efficiency by compressing and expanding air to lose energy and cool down, using materials like aluminum for cost-effectiveness and compatibility with existing fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used to achieve stronger cooling ability for high-performance SoC systems, then cooling performance is improved, but system complexity and cost increase significantly
Solution Approach 1:
The patent changes the physical parameters of air cooling by incorporating compression and expansion chambers that modify air pressure and temperature. The compression chamber compresses ambient air to increase its temperature and pressure, while the expansion chamber allows the compressed air to expand and cool down, creating a parametric cooling effect that enhances air cooling performance without adopting liquid cooling systems
Solution Approach 2:
The patent introduces compressed air as an intermediary medium between the ambient environment and the heat source. By compressing ambient air and then allowing it to expand, the system creates a cooled intermediary airflow that serves as the cooling medium for the SoC system, avoiding direct contact with liquid coolant while achieving enhanced cooling
2Temperature
If fan size is increased to improve cooling ability, then cooling performance is improved, but the size of racks is exceeded
Solution Approach 1:
Instead of increasing fan size, the patent changes the thermal parameters of the cooling air through compression and expansion. The compression chamber increases air pressure and temperature, while the expansion chamber decreases temperature, creating a more effective cooling airflow from the same fan size
Solution Approach 2:
The cooling system is segmented into distinct functional chambers: a compression chamber for compressing ambient air, an expansion chamber for cooling the compressed air, and a fan assembly. This segmentation allows each component to perform its specific function efficiently within the constrained rack space
3Device complexity
If ambient air is used directly for cooling, then system simplicity is maintained, but cooling performance is insufficient for high-power SoC systems
Solution Approach 1:
The patent applies parameter changes to ambient air by using compression and expansion chambers to modify its pressure and temperature. The compression chamber increases air pressure and temperature, and the expansion chamber decreases temperature, transforming ordinary ambient air into a more effective cooling medium without overcomplicating the system
Data Source
AI summary
A fan accessory includes an air-inlet piece configured to be disposed in front of a fan and has a first hole adjacent to an outside and a second hole adjacent to the fan. The first hole is in communication with the second hole. The first hole has a first diameter gradually decreased in an airflow direction from the outside to the fan, and the second hole has a second diameter gradually increased in the airflow direction. The fan accessory also includes an air-outlet piece configured to be disposed behind the fan and have a third hole. The third hole has a third diameter gradually decreased in the airflow direction.