Fan Motor Base Layout for Uniform PCB Encapsulation
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Solution Overview
Problem
Conventional fans experience electronic component loosening and malfunction due to uneven filler thickness causing thermal expansion and contraction stresses, leading to potential detachment from the circuit board.
Innovation Solution
A fan design featuring a wall thickness arrangement on the motor base with concave parts corresponding to electronic components, allowing a uniform enclosing layer to be formed, which reduces internal stresses and prevents component detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a filler is filled into the space between the circuit board and motor base to protect electronic components, then the protection against external liquid and dust is improved, but the uneven thickness of the filler causes thermal expansion and contraction stresses that lead to electronic component loosening and detachment
Solution Approach 1:
The motor base is designed with localized concave portions that correspond to the positions and heights of electronic components on the circuit board. This creates local variations in the filler thickness, allowing the filler to maintain a uniform thickness around each electronic component while still providing overall protection. The concave portions ensure that the filler forms an enclosing layer of consistent thickness, preventing thermal stress-induced loosening of components.
2Object-affected harmful factors
If the filler thickness is increased to improve protection, then the protective effect is enhanced, but the thermal expansion and contraction stresses increase, causing electronic components to loosen and detach
Solution Approach 1:
By creating concave portions in the motor base at specific locations, the design allows the filler to achieve optimal protective thickness locally around each electronic component without uniformly increasing the overall filler thickness. This localized approach maintains adequate protection while minimizing unnecessary thermal stress on the components.
3Reliability
If the filler thickness is reduced to minimize thermal stress, then the thermal expansion and contraction stresses are reduced, but the protection against external liquid and dust is insufficient
Solution Approach 1:
The concave portions in the motor base enable the filler to achieve adequate protective thickness specifically where electronic components are located, rather than requiring uniform thickness throughout the entire space. This ensures sufficient protection against external contaminants while maintaining appropriate thickness to minimize thermal stress on components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The uniform enclosing layer maintains electronic components securely, preventing malfunction and extending the fan's lifespan by mitigating thermal expansion and contraction stresses.
Implementation Method 1
As the fan is subjected to changes of environmental temperature, the filler 17 undergoes thermal expansion and contraction.
Implementation Method 2
As the fan is subjected to changes of environmental temperature, the filler 17 undergoes thermal expansion and contraction.
Data Source
AI summary
A fan comprises a fan frame, a motor, an impeller, a circuit board and an enclosing layer. The fan frame has a motor base disposed in a central portion thereof. The motor is mounted on the motor base and has a rotor, a stator and a bearing unit. The stator is disposed around the outer periphery of the bearing unit, and the rotor is sheathed on the stator and the bearing unit. The impeller is mounted on the motor. The circuit board is sheathed on the bearing unit and located between the stator and the motor base, and has a plurality of electronic components disposed on a first surface thereof. The stator and the circuit board are enclosed by the enclosing layer, and the plurality of electronic components are enclosed by the uniform enclosing layer with a specific thickness.