Fan Case Opening for Dust Removal in Notebook Cooling
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Solution Overview
Problem
Conventional heat-dissipating units in electronic devices face increased cost and weight due to the need for additional components and complex structures to remove dust from heat-dissipating components, which impairs their cooling efficiency.
Innovation Solution
A simplified dust removal mechanism using a first shutter means on the heat-dissipating component and an opening in the fan case, allowing air to flow from the fan towards the dust accumulation area, effectively removing dust without additional components or increased weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a brush and brush driving section are added to remove dust from the heat-dissipating component, then dust removal effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the dust removal function from the cooling air flow path by introducing a separate dust extraction opening in the fan case. This allows dust to be removed through a dedicated path without requiring complex mechanical cleaning components like brushes, thereby simplifying the overall device structure while maintaining effective dust removal.
Solution Approach 2:
The patent uses an intermediary approach by introducing a dust extraction opening as a mediator between the dust accumulation area and the external environment. This opening serves as a simple yet effective intermediary structure that enables dust removal without requiring direct contact with moving parts or complex mechanical systems.
2Reliability
If a brush and brush driving section are added to remove dust from the heat-dissipating component, then dust removal effectiveness is improved, but device weight increases
Solution Approach 1:
The patent removes the heavy brush and brush driving section components from the design by extracting the dust removal function through a simple opening in the fan case. This extraction eliminates unnecessary weight while maintaining the essential dust removal capability through air flow guided by the opening structure.
Solution Approach 2:
The patent replaces complex, heavy mechanical cleaning components with a simple, lightweight opening structure that utilizes existing air flow. This approach uses the disposable nature of air flow to carry dust away, eliminating the need for persistent mechanical cleaning components that would add weight.
3Temperature
If fins are arrayed at narrow spacing to increase surface area, then heat-dissipating effect is improved, but dust accumulation problem worsens
Solution Approach 1:
The patent extracts the dust removal function from the heat dissipation structure by adding a separate dust extraction opening in the fan case. This allows the fins to maintain narrow spacing for optimal heat dissipation while the separate opening handles dust removal, preventing dust accumulation on the fin surfaces.
Solution Approach 2:
The dust extraction opening acts as an intermediary structure that prevents dust from reaching and accumulating on the fins. By providing a dedicated path for dust removal through the fan case, the opening protects the narrow-spaced fins from contamination while allowing them to maintain their optimized heat dissipation configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution maintains cost and weight efficiency while effectively removing dust from the heat-dissipating components, enhancing the cooling performance of electronic devices by simplifying the structure and eliminating the need for additional components.
Implementation Method 1
heat from electronic components (heat-emitting components), such as central processing units (CPUs), which emit heat during operation, is transferred through a heat pipe or the like to a heat-dissipating component, heat exchange with air (cooling air) supplied from a fan is made to occur
Implementation Method 2
a fan for supplying air to the heat-dissipating component
Data Source
AI summary
A notebook computer 1 is provided with: a casing in which a CPU is accommodated; a heat-dissipating component 37 having a plurality of fins; and a fan 31, and operates such that heat transferred from the CPU to the heat-dissipating component 37 is heat-exchanged with air supplied from the fan 31, and released to the exterior of the casing. The heat-dissipating component 37 is disposed at an air outlet 32b of the fan 31. An opening 35 is formed, between the air outlet 32b and a fan main unit 33, in a fan case 32. First shutter means 39 is provided on a discharge outlet surface of the heat-dissipating component 37. With this structure, increase in cost and weight can be restrained, and dust on the heat-dissipating component can be removed with a simplified structure.