Fan Casing and Heat Sink Layout for SSD Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling solutions for electronic components like SSDs in electronic apparatuses are inadequate, leading to reduced processing capacity due to insufficient heat dissipation.
Innovation Solution
An electronic apparatus design that includes a fan with a metal casing and a heat sink thermally connected to a heat-generating component, utilizing airflow from the fan to dissipate heat through air vents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipating plate is provided on the SSD, then heat dissipation is improved, but processing capacity is reduced due to throttling
Solution Approach 1:
The patent combines the fan housing and heat sink into a single integrated structure. The fan housing serves dual purposes: protecting the fan and dissipating heat from the SSD through its metal casing and air vents, eliminating the need for a separate heat dissipating plate and enabling more effective cooling
Solution Approach 2:
The fan housing is designed to perform multiple functions simultaneously: it protects the fan, dissipates heat from the SSD, and guides airflow. This multi-functionality allows the same component to address both protection and thermal management needs, improving cooling efficiency without adding separate components
2Temperature
If a separate heat dissipating plate is added to cool SSD, then cooling efficiency improves, but device complexity increases
Solution Approach 1:
The patent merges the fan housing and heat sink into one integrated component. The metal casing of the fan housing serves as the heat dissipation structure, and air vents are incorporated directly into the housing, eliminating the need for separate heat dissipating plates and reducing overall structural complexity
Solution Approach 2:
The fan housing is designed as a multi-functional component that simultaneously protects the fan, dissipates heat from the SSD, and manages airflow. This universality reduces the number of separate components needed, simplifying the overall device structure while maintaining effective cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency for heat-generating components, maintaining optimal processing capacity by effectively dissipating heat.
Implementation Method 1
a fan (30) equipped with a metal casing (30a, 30b, 30c, 30d); and a heat sink (29) provided adjacent to the fan (30) to dissipate heat due to the fact that an airflow by the fan (30) flows toward air vents (41)
Implementation Method 2
the first electronic component (60) is thermally connected from the metal casing (30a, 30b, 30c, 30d) of the fan (30) to the heat sink (29)
Data Source
AI summary
An electronic apparatus includes a storage device that generates heat, a fan having a metal casing, a heat sink provided adjacent to the fan to dissipate heat due to the fact that an airflow by the fan flows toward air vents, a CPU, and a heat pipe for transporting the heat of the CPU to the heat sink. The storage device is thermally connected from a flat surface section of the fan to a flat surface section of the heat sink.