Fan Device Assembly Without Glue Using Bridging Members
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Solution Overview
Problem
Conventional fan devices face challenges in miniaturization, where excessive glue usage can lead to increased thickness and instability due to the inclination of components, making it difficult to control the assembly and maintain a slim form factor.
Innovation Solution
The fan device design incorporates a housing with a bottom plate, bridging members, and a hollow protruding portion, allowing the circuit board and metal member to be affixed without glue, using thermal deformation or crimping to secure the bridging members and insert molding for the metal member, ensuring stable assembly and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glue is used to attach the circuit board and silicon steel sheet to the housing, then the components can be securely fixed, but the overall thickness of the fan increases and the assembly becomes prone to inclination
Solution Approach 1:
The patent removes the glue layer from the assembly structure entirely. Instead of using adhesive bonding, the circuit board and silicon steel sheet are directly attached to the housing through mechanical means (rivets or clips), eliminating the glue layer thickness and preventing inclination caused by excessive glue application.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (glue) with a mechanical bonding mechanism (rivets or clips). This substitution allows for precise thickness control and prevents component inclination by providing rigid mechanical support without the need for adhesive layers.
2Reliability
If excessive glue is applied to attach components, then the components can be securely fixed, but the members become inclined or interfered with after hardening
Solution Approach 1:
The patent extracts the glue layer from the assembly process, eliminating the source of inclination and alignment problems. By using mechanical fastening methods instead, the components maintain stable alignment without the interference caused by glue hardening.
Solution Approach 2:
The patent substitutes mechanical fastening (rivets or clips) for chemical bonding (glue). This replacement ensures stable component alignment by providing rigid mechanical constraints that prevent inclination, avoiding the alignment issues that arise when glue hardens.
3Volume of moving object
If miniaturization is pursued in the fan structure, then the size is reduced, but it becomes difficult to control the amount of glue and maintain assembly precision
Solution Approach 1:
The patent removes glue from the miniaturized fan assembly, eliminating the variable that becomes difficult to control at small scales. The mechanical fastening method (rivets or clips) provides consistent and controllable attachment without the precision challenges of applying and controlling glue amounts in miniaturized structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables reduced assembly time and thickness, preventing component inclination and maintaining the fan's slim profile while ensuring secure attachment of the circuit board and metal member to the housing.
Implementation Method 1
using thermal deformation or crimping to secure the bridging members
Implementation Method 2
The magnetic member is disposed corresponding to the driving coils. The metal member is disposed on the second surface and corresponds to the magnetic member.
Data Source
AI summary
A fan device is provided, including a housing, a circuit board, a plurality of driving coils, at least one magnetic member, and a metal member. The housing includes a first surface, a second surface corresponding to the first surface, and a hollow protruding portion protruding from the first surface. The circuit board is disposed on the first surface, and the driving coils are disposed on the circuit board. The magnetic member is disposed corresponding to the driving coils. The metal member is disposed on the second surface and corresponds to the magnetic member. A method for manufacturing the fan device is also provided.