Centrifugal Fan Heat Conduction Assembly for Laptop Cooling
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Solution Overview
Problem
Conventional heat dissipation systems for laptop computers, particularly those with high-end processors, face inefficiencies in transferring heat from the central processing unit to the fan, limiting effective heat removal and potentially leading to overheating issues due to the lack of direct thermal contact between the heat source and the fan.
Innovation Solution
A heat dissipation system incorporating a centrifugal fan, a heat pipe, a heat dissipater, and a heat conduction assembly, where the heat conduction assembly includes a first part mounted on the heat source and a second part integrated with the centrifugal fan housing, allowing for dual thermal conduction pathways to efficiently transfer heat away from the source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat dissipation systems use indirect thermal contact between heat source and fan, then device structure is simpler, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat conduction assembly is divided into two distinct parts: a first part that directly contacts the heat source and a second part that contacts the centrifugal fan. This segmentation creates dual thermal conduction pathways, allowing heat to be transferred through multiple routes simultaneously, thereby improving heat dissipation efficiency while maintaining manufacturing simplicity.
Solution Approach 2:
The heat conduction assembly acts as an intermediary component between the heat source and the centrifugal fan. By introducing this intermediate thermal conduction path, the system enables more efficient heat transfer without requiring direct contact between the heat source and fan, thus resolving the contradiction between structural simplicity and heat dissipation efficiency.
2Reliability
If dual thermal conduction pathways are implemented, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat conduction assembly integrates both thermal conduction functions into a single component structure that includes a first part and a second part. By merging these functions into one integrated assembly rather than using separate components, the system achieves dual thermal pathways without proportionally increasing overall device complexity.
Solution Approach 2:
The heat conduction assembly serves multiple functions: it provides structural support, establishes thermal contact with the heat source, and conducts heat to the centrifugal fan. This multi-functionality reduces the need for additional dedicated components, thereby improving heat dissipation efficiency without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency by providing two pathways for heat removal, effectively addressing the inefficiencies in conventional systems and ensuring reliable cooling for high-performance laptop processors.
Implementation Method 1
The heat pipe is configured to be in thermal contact with the heat source
Implementation Method 2
The heat dissipater is located at the outlet and in thermal contact with the heat pipe
Implementation Method 3
The centrifugal fan includes a housing and an impeller. The housing has an accommodation space, an inlet, and an outlet
Implementation Method 4
The second part is in thermal contact with the first part
Data Source
AI summary
A heat dissipation system configured to be in thermal contact with a heat source. The heat dissipation system includes a centrifugal fan, a heat pipe, a heat dissipater, and a heat conduction assembly. The centrifugal fan includes a housing and an impeller. The housing has an accommodation space, an inlet, and an outlet. The inlet and the outlet are connected to the accommodation space. The impeller is located in the accommodation space. The heat pipe is configured to be in thermal contact with the heat source. The heat dissipater is located at the outlet and in thermal contact with the heat pipe. The heat conduction assembly includes a first part configured for the heat source to be mounted thereon and in thermal contact with the heat source, and a second part disposed on the housing and partially located in the accommodation space.