Fan Housing EMI Shielding Thermal Coupling
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Solution Overview
Problem
Existing head mountable computer systems for augmented and virtual reality struggle with effective electromagnetic interference (EMI) shielding and thermal management, which can lead to performance issues and user discomfort.
Innovation Solution
The proposed solution involves an electronic assembly that includes a printed circuit board (PCB), an electronic component, an electrically conductive fence surrounding the component, and a fan assembly with an EMI shield. The EMI shield is designed to reduce electromagnetic interference and includes a fan housing with fan blades and an EMI foam for thermal coupling and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an EMI shield is added to reduce electromagnetic interference, then EMI shielding performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the EMI shield with the fan housing into a single integrated structure. The fan housing itself is designed with EMI shielding properties, eliminating the need for a separate EMI shield component. This merging of functions reduces device complexity while maintaining EMI protection.
Solution Approach 2:
The fan housing is designed to serve multiple functions: it provides structural support for the fan assembly, acts as an EMI shield, and serves as a mounting structure for the fan blades. This multi-functionality reduces the overall component count and simplifies the device architecture.
2Temperature
If thermal coupling is enhanced between fan housing and heat-generating components, then thermal management performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The fan housing is designed to be thermally conductive and directly contacts the heat-generating components without requiring additional thermal interface materials or complex thermal management structures. The housing itself provides the thermal coupling pathway, simplifying the system while maintaining effective heat dissipation.
3Temperature
If fan assembly is added for cooling, then thermal management is improved, but EMI interference and noise increase
Solution Approach 1:
The fan housing is designed to integrate EMI shielding functionality directly into the structural component. The housing incorporates conductive materials or coatings that provide EMI protection while maintaining the fan assembly's cooling function, thereby reducing EMI interference without compromising cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces EMI, enhances thermal management by allowing direct thermal coupling between the fan housing and heat-generating components, and improves overall system performance and user experience.
Implementation Method 1
an electromagnetic interference (EMI) foam disposed between the fence and the housing
Implementation Method 2
a plurality of fan blades configured to rotate within the housing
Implementation Method 3
the fan housing can be thermally coupled to the electronic component via a thermal paste disposed between the fan housing and the electronic component
Data Source
AI summary
An electronic assembly includes a printed circuit board (PCB), an electronic component coupled to the PCB, an electrically conductive fence coupled to the PCB and surrounding a perimeter of the electronic component, and a fan assembly. The fan assembly includes a housing coupled to the fence and disposed over the electronic component and a plurality of fan blades configured to rotate within the housing.