Electronic Device Active Cooling Fan Housing Integration
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Solution Overview
Problem
Existing electronic devices with internal fans face challenges such as dust and moisture ingress, electromagnetic radiation interference, and increased component and assembly costs due to the need for additional fan housings and complex electrical connections.
Innovation Solution
The electronic device integrates the fan's main body directly with the housing, eliminating the need for a dedicated fan housing and allowing for a compact design. This configuration includes a bushing for the fan rotor, an electrically conductive main body, and a chamber separated from the interior to protect components and improve EMC/ESD protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dedicated fan housing is used to protect against dust and moisture ingress, then protection reliability is improved, but device complexity and installation space requirements increase
Solution Approach 1:
The patent merges the fan housing with the device housing by integrating the fan mounting structure directly into the housing interior. The fan is mounted on a mounting structure that is part of the housing itself, eliminating the need for a separate dedicated fan housing. This integration maintains protection reliability while reducing device complexity and space requirements.
2Reliability
If a dedicated fan housing with sealing elements is used, then protection against dust and moisture is improved, but EMC protection is compromised due to additional openings
Solution Approach 1:
The fan housing is merged with the device housing, allowing the use of existing housing walls and openings for EMC protection. The mounting structure is integrated into the housing, enabling the housing itself to provide both mechanical protection and electromagnetic shielding without requiring additional sealing elements that would compromise EMC protection.
3Productivity
If complete fan assembly including housing, cable and plug connector is installed within housing, then cooling functionality is achieved, but dust and moisture may contaminate electronic parts
Solution Approach 1:
The patent segments the fan mounting from the device interior by providing a dedicated mounting structure on the housing interior that isolates the fan assembly. This segmentation allows the fan to be positioned within the housing while preventing direct contact between the fan's moving parts and the device's electronic components, thereby reducing contamination risk while maintaining cooling functionality.
4Strength
If fan is fastened from outside housing, then mechanical protection is improved, but assembly complexity and component costs increase due to additional safeguards and cable laying
Solution Approach 1:
The fan mounting structure is merged with the housing itself, eliminating the need for separate external fastening mechanisms and additional protective safeguards. The housing provides both structural support and mechanical protection for the fan, simplifying the assembly process and reducing component costs while maintaining adequate mechanical protection.
5Productivity
If fan housing constituents and electrical connections are added, then fan functionality is achieved, but installation space is restricted
Solution Approach 1:
The fan housing constituents are merged with the device housing, and electrical connections are integrated into the housing structure. This integration eliminates the need for separate fan housing components and reduces the overall installation space required for the fan assembly while maintaining full fan functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a compact electronic device with enhanced ESD/EMC and IP protection, reducing component costs and assembly complexity while effectively preventing dust, moisture, and electromagnetic interference from reaching internal components.
Implementation Method 1
active convection solutions with forced air movement by fans are known from the prior art
Implementation Method 2
the removal of heat from the parts from which heat is to be dissipated normally takes place by way of thermal coupling to a housing by a thermally conductive material
Implementation Method 3
the removal of heat to the ambient air takes place via external cooling fins
Implementation Method 4
the main body is electrically conductive
Data Source
AI summary
The disclosure relates to an electronic device with active cooling. In order to make a compact design of an electronic device possible and furthermore ensure a high level of ESD/EMC protection and a high level of IP protection, it is proposed according to the disclosure that a housing of the electronic device is connected to a main body of a fan. When the main body and housing are in a connected state, an opening to the interior of the housing is closed off. The main body is furthermore connected to a bushing on which the fan rotor is mounted for rotation. In the connected state, a chamber is furthermore formed which is separated from the interior of the housing and in which the fan rotor is arranged. Here, the chamber forms a housing for the fan rotor.