Fan-Like Liquid Cooling Module for Compact Heat Transfer
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Solution Overview
Problem
Existing liquid cooling modules face challenges in maintaining effective cooling performance while minimizing height, especially in densely packed electronic devices where space is limited.
Innovation Solution
The liquid cooling module incorporates a heat receiver with a fan-like first flow passage, a diffuser with microchannel grooves, and a third flow passage that separates from the heat receiver, allowing for efficient heat transfer and refrigerant diffusion while maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the flow path is designed to spread in a fan-like shape and then toward the heat receiver, then heat transfer efficiency is improved, but the height of the module increases
Solution Approach 1:
The flow path is designed to spread in a fan-like shape in the plan view (horizontal dimension) rather than extending vertically, allowing the refrigerant to cover a larger heat transfer area without increasing module height. The flow path then turns toward the heat receiver in a controlled manner, utilizing horizontal space efficiency to maintain compact vertical dimensions while achieving effective heat transfer.
2Temperature
If the flow path is made complex to diffuse refrigerant effectively, then cooling performance is improved, but device complexity increases
Solution Approach 1:
The flow path is segmented into distinct functional sections: an inlet passage, a fan-like spreading flow path, a second flow path turning toward the heat receiver, and an outlet passage. This segmentation allows each section to perform its specific function efficiently while maintaining overall simplicity in design and manufacturing.
Solution Approach 2:
The diffuser is designed with grooves that are specifically positioned and dimensioned to match the local flow requirements. The grooves are arranged to diffuse the refrigerant effectively in the region where it is most needed, without requiring complex flow paths throughout the entire module. This localized approach to diffusion maintains simplicity while improving cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency by diffusing the refrigerant and ensuring effective heat transfer to the CPU, while also reducing the overall height of the liquid cooling module, making it suitable for densely packed electronic devices.
Implementation Method 1
the refrigerant liquid removes heat generated in the heat element chip via phosphorus and is heated
Implementation Method 2
a diffuser in which a plurality of grooves that continues from the flow path of the second flow passage in the heat receiver and diffuses the liquid refrigerant along a surface on an opposite side of the heat receiving surface is formed
Data Source
AI summary
A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.