Centrifugal Fan Module with Vapor Chamber for Heat Spill Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional centrifugal fan modules in notebook computers suffer from heat spillage to the keyboard or housing, excessive noise, and inefficient heat dissipation due to increased CPU heat generation, leading to poor user experience.
Innovation Solution
A centrifugal fan module design incorporating a housing, blade unit, heat sink, and vapor chamber, where the vapor chamber is in direct contact with the heat source, reducing thermal resistance and using airflow to transmit heat directly to the heat sink, while the U-shaped outlet structure and restriction post minimize noise and heat transfer to non-essential components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipe and heat sink design is used, then heat dissipation is provided, but heat spills over to keyboard or computer housing causing poor user experience
Solution Approach 1:
The heat sink is extracted from the conventional heat pipe connection and directly connected to the vapor chamber, separating the heat dissipation function from the heat transmission path to prevent heat spillage to surrounding components
Solution Approach 2:
The vapor chamber acts as an intermediary between the heat source and heat sink, providing a dedicated heat transmission path that directs heat away from the keyboard and housing areas
2Power
If increased computing power is provided, then CPU heat generation increases, but heat accumulates on heat pipe and heat sink
Solution Approach 1:
The conventional heat pipe mechanical system is replaced with a vapor chamber system that uses phase change (liquid-vapor transition) for heat transmission, enabling more efficient heat dissipation for high-power CPUs
Solution Approach 2:
The vapor chamber utilizes phase transitions (liquid to vapor and vapor back to liquid) to efficiently transmit heat from the CPU to the heat sink, preventing heat accumulation even under increased computing loads
3Temperature
If airflow passes through heat sink, then heat is removed, but excessive noise is generated
Solution Approach 1:
The outlet structure extends in the wind-output direction, creating a three-dimensional airflow path that reduces turbulence and noise while maintaining effective heat removal through the heat sink
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents heat accumulation in non-essential areas, reduces noise, and enhances user experience by improving heat dissipation and noise reduction.
Implementation Method 1
vapor chamber
Implementation Method 2
heat transmission path
Implementation Method 3
heat sink
Implementation Method 4
heat sink
Implementation Method 5
centrifugal fan module
Implementation Method 6
blade unit
Data Source
AI summary
A centrifugal fan module is provided. The centrifugal fan module includes a housing, a blade unit, a heat sink and a vapor chamber. The housing includes a bottom cover, a sidewall, a top cover and an outlet structure, wherein the bottom cover is connected to the bottom of the sidewall, the top cover is connected to the top of the sidewall, and the outlet structure is connected to the top cover and the sidewall. The blade unit is disposed in the housing, wherein the blade unit is located between the bottom cover and the top cover. The heat sink is disposed on the vapor chamber, the heat sink is located between the vapor chamber and the top cover, and the heat sink is located between the outlet structure and the blade unit.