Fan Module With Atomizing Mist For Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods in electronic apparatuses, such as fans and heat sinks, fail to meet the increasing heat dissipation requirements as electronic components continue to miniaturize and generate more heat, leading to frequent overheating issues.
Innovation Solution
A fan module that incorporates a base, impeller, liquid container, atomizing device, and cover to create a mist that absorbs heat, enhancing heat dissipation by combining conventional airflow with the cooling effect of the mist, which is drawn through and out of the module by the impeller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional heat sinks and fans are used for heat dissipation, then the structure is simple and easy to manufacture, but the heat dissipation capacity is insufficient for high-performance electronic components
Solution Approach 1:
The patent combines conventional fan-based air cooling with mist spray cooling into a single integrated heat dissipation system. The mist generating device is incorporated within the fan module housing, allowing both airflow generation and mist distribution to occur simultaneously through coordinated operation, thereby significantly enhancing heat dissipation capacity while maintaining reasonable structural complexity
Solution Approach 2:
The fan module is designed to perform multiple functions: it generates airflow for convection cooling, distributes mist for evaporative cooling, and houses both the motor and liquid container. This multi-functional design allows a single device to address multiple heat dissipation mechanisms simultaneously, improving overall heat removal capability without requiring separate independent systems
2Volume of moving object
If electronic components are miniaturized and densely packed, then the device size is reduced and integration is improved, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a mist spray system that utilizes liquid aerosolization to enhance heat dissipation. The mist generating device sprays fine liquid droplets into the airflow path, where they evaporate and absorb heat from the electronic components. This pneumatic-hydraulic approach allows efficient heat removal from miniaturized, densely packed components without increasing the overall device volume
Solution Approach 2:
The system changes the physical state of the cooling medium by transitioning from liquid mist to vapor through evaporation. This phase change absorbs significant latent heat from the electronic components, providing enhanced cooling efficiency for miniaturized devices. The mist droplet size and distribution parameters are optimized to maximize evaporative heat transfer while maintaining compact dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fan module effectively reduces electronic apparatus temperatures by promoting heat dissipation through both airflow and mist absorption, meeting the increased heat dissipation needs and reducing overheating frequency.
Implementation Method 1
The atomizing device is disposed on the liquid container and for atomizing the liquid to form a mist to spray for absorbing the heat produced by the electronic component
Implementation Method 2
the mist is drawn into the base through the air inlet of the cover, and is drawn out of the base through the air outlet... utilizes mist for reducing temperature in electronic apparatus
Implementation Method 3
the impeller rotates, the blade of the impeller drives airflow so that the mist is drawn into the base through the air inlet of the cover, and is drawn out of the base through the air outlet
Implementation Method 4
The heat sink 30 is connected with a heat pipe 32. The heat sink 30 has several fins 300. An electronic component (not shown) is placed at a holding base 4 on the heat pipe 32. The heat produced by the electronic component during operation is conducted to the heat sink 30 through the heat pipe 32
Implementation Method 5
The heat sink 30 is connected with a heat pipe 32
Data Source
AI summary
The invention discloses an electronic apparatus and a fan module thereof. The fan module includes a base, an impeller, a liquid container, an atomizing device and a cover. The impeller is provided in the base. The liquid container is placed at the center of the impeller, and the liquid container contains a liquid. The atomizing device is disposed on the liquid container, and the atomizing device can atomize the liquid to form a mist to spray in order to absorb the heat in the electronic apparatus. The cover covers the base and forms an air outlet with the base. Furthermore, the cover has an air inlet. When the impeller rotates, the blade of the impeller drives airflow mixed the heated mist to enter into the base through the air inlet of the cover, and to exit from the base through the air outlet.