Perpendicular Fan Module PCB Mounting for Depth Reduction
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Solution Overview
Problem
Traditional fan modules in electronic devices require a larger space due to the parallel orientation of the printed circuit board and main board, increasing device size and costs.
Innovation Solution
A fan module design featuring a tray, fan, supporting frame, and printed circuit board assembly where the printed circuit board is mounted in a thickness direction, utilizing a supporting frame with a guiding bar and rib structure to reduce depth length, allowing for perpendicular orientation and compact assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printed circuit board is disposed parallel to the main board in the same direction, then electrical connection is achieved, but the overall space in depth direction is increased
Solution Approach 1:
The patent changes the orientation of the printed circuit board from parallel (same direction) to perpendicular (thickness direction) relative to the main board. This dimensional reorientation allows the circuit board to extend in a different spatial dimension, reducing the depth direction space occupation while maintaining electrical connectivity through the connector.
2Volume of moving object
If the printed circuit board is mounted in thickness direction with supporting frame, then overall size is reduced, but structural complexity is increased
Solution Approach 1:
The patent divides the supporting structure into separate functional components: a tray for holding the fan, a supporting frame with guiding bars for positioning, and a connector for electrical connection. This segmentation allows each component to perform its specific function efficiently while enabling modular assembly, reducing overall complexity despite the increased number of parts.
Solution Approach 2:
The supporting frame acts as an intermediary structure between the tray and the printed circuit board. It provides guiding bars and ribs that facilitate precise positioning and connection, simplifying the assembly process and ensuring proper alignment without requiring complex mounting mechanisms.
3Reliability
If traditional fan module design is used, then electrical connectivity is maintained, but device size and costs increase
Solution Approach 1:
The patent merges the fan assembly with the printed circuit board assembly into a single integrated fan module. The tray, fan, supporting frame, and connector are combined into one unit that can be assembled and installed as a single component, reducing the number of separate parts, simplifying manufacturing, and lowering overall device size and cost.
Data Source
AI summary
A fan module used on an electronic device, the electronic device includes a main board and a connector. The fan module includes a tray, a fan mounted on the tray, a supporting frame mounted on the fan, and a printed circuit board mounted on the fan by the supporting frame, the printed circuit board includes a main body and a conducting strip. The main board is perpendicular to the printed circuit board, and the connector is electrically connected to the conducting trip. The assembly of the printed circuit board and the main board is perpendicular to each other, and the supporting frame is compact to have the printed circuit board mounted on the fan, which is greatly reducing the size of the fan module in a depth direction with space saved and low cost.