Fan-Out Package Antenna Layout for Custom Multi-Band Bandwidth
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Solution Overview
Problem
Conventional built-in antennas in mobile devices face limitations in multi-band applications due to a fixed bandwidth associated with the distance between the printed circuit board and the redistribution line, which restricts flexibility in bandwidth customization.
Innovation Solution
A fan-out package is formed by bonding a Radio-Frequency Integrated Circuit (RFIC) die to a redistribution structure, with an antenna substrate and a package component bonded to opposite sides, allowing for customizable bandwidths by selectively distributing antenna components across the substrate, redistribution structure, and package component, enabling adjustable spacings and component positions to achieve desired bandwidths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antennas are formed with portions in redistribution lines and other portions in printed circuit board, then the antenna structure is integrated, but the bandwidth is fixed and cannot be customized for multi-band applications
Solution Approach 1:
The antenna is divided into multiple segments distributed across different layers and substrates. Specifically, the antenna components are segmented between the antenna substrate, redistribution structure, and package component, allowing independent adjustment of each segment's position and dimensions to achieve desired bandwidth characteristics for different frequency bands.
Solution Approach 2:
The antenna structure extends into the third dimension by utilizing vertical spacing between multiple substrates (antenna substrate, redistribution structure, and package component). This multi-layer configuration allows bandwidth adjustment through inter-substrate spacing without increasing the planar footprint, enabling multi-band operation with customizable bandwidths.
2Adaptability or versatility
If the distance between printed circuit board and redistribution line is fixed, then the manufacturing process is simplified, but the bandwidth cannot be adjusted for different applications
Solution Approach 1:
The antenna structure incorporates adjustable spacing between substrates that can be dynamically configured during manufacturing to achieve different bandwidth characteristics. The distance between the antenna substrate and package component can be varied to tune the bandwidth for different frequency bands, providing manufacturing flexibility without compromising structural integrity.
Solution Approach 2:
The invention enables bandwidth customization by changing physical parameters such as the spacing between substrates, the dimensions of antenna components, and the positions of conductive features. These parameter variations allow the same antenna structure to be manufactured with different bandwidth characteristics to suit various multi-band applications.
3Adaptability or versatility
If antenna components are distributed across multiple substrates, then bandwidth customization is enabled, but the manufacturing process becomes more complex
Solution Approach 1:
The antenna components distributed across multiple substrates are electrically merged through conductive connections via through-substrate vias and redistribution lines. This merging maintains the electrical continuity required for antenna operation while preserving the physical distribution that enables bandwidth customization, effectively combining the benefits of both approaches.
Solution Approach 2:
The redistribution structure serves multiple functions: it provides electrical interconnection between antenna components on different substrates, enables bandwidth tuning through adjustable spacing, and maintains mechanical support for the distributed antenna structure. This multi-functionality reduces the need for additional specialized components, simplifying the overall package design.
Data Source
AI summary
A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.