Fan-Out Package Antenna Layout for RF Q-Factor Reliability
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Solution Overview
Problem
The challenge in the semiconductor industry is to ensure the signal performance and reliability of radio frequency integrated circuits (RF-ICs) in package design, particularly in maintaining the Q-factor and reliability amidst the miniaturization of components and packages.
Innovation Solution
The solution involves fabricating an integrated fan-out package with a redistribution circuit structure that includes a wiring-free dielectric portion covering the antenna region, conductive pillars or vias, and a protection layer, which enhances signal performance and reliability by eliminating conductive layers within the dielectric portions and using dummy patterns that do not affect the signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional package design with conductive layers is used, then manufacturing is easier, but signal performance and Q-factor deteriorate
Solution Approach 1:
The patent extracts and removes the conductive layer from the dielectric portion that covers the antenna region, creating a wiring-free dielectric structure. This extraction eliminates the harmful interaction between conductive layers and RF signals, thereby improving Q-factor and signal performance while accepting increased structural complexity in the package design.
2Productivity
If minimum feature size is reduced to increase integration density, then more components can be integrated, but package area decreases requiring smaller packages
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked architecture by placing the antenna region and wiring-free dielectric portion vertically above the integrated circuit. This dimensional change allows higher integration density without proportionally reducing package area, as the expanded vertical space compensates for the compact horizontal footprint.
3Ease of manufacture
If dummy patterns are added to the redistribution circuit structure, then manufacturing is facilitated, but they must not interfere with signal quality
Solution Approach 1:
The patent applies different structural qualities to different regions: the dielectric portion over the antenna region is wiring-free to maintain signal quality, while other regions can contain conductive layers and dummy patterns for manufacturing ease. This localized differentiation allows dummy patterns to be placed in non-critical areas where they aid fabrication without interfering with RF signal performance.
Data Source
AI summary
An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an antenna region. The insulating encapsulation encapsulates the integrated circuit. The redistribution circuit structure is disposed on the integrated circuit and the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit, and the redistribution circuit structure includes a redistribution region and a dummy region including a plurality of dummy patterns embedded therein, wherein the antenna region includes an inductor and a wiring-free dielectric portion, and the wiring-free dielectric portion of the antenna region is between the inductor and the dummy region.