Fan-Out Package Backside Thermal Structure for Heat Dissipation
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently dissipating heat, which limits the integration density and performance of semiconductor devices, especially as devices become smaller and more complex.
Innovation Solution
The integration of a backside redistribution structure with metal paste inclusions, such as copper or silver, which are cured in a reflow process to enhance thermal conductivity and improve heat dissipation within the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional semiconductor packaging is used, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent embeds thermally conductive particles (such as metal particles or ceramic particles) into the molding compound to create a composite material that maintains structural integrity while significantly improving heat dissipation efficiency. This allows the package structure to remain relatively simple while achieving enhanced thermal management through material composition rather than structural complexity
Solution Approach 2:
The patent concentrates thermally conductive particles in specific regions where heat generation is highest, such as near the semiconductor die or heat-generating components. This localized enhancement of thermal conductivity allows effective heat dissipation without requiring the entire package structure to be complex or use expensive materials throughout
2Quantity of substance
If integration density is increased, then device functionality is enhanced, but heat dissipation becomes more difficult
Solution Approach 1:
By incorporating thermally conductive particles into the molding compound, the patent creates a material that can handle higher heat loads generated by increased integration density. The composite structure allows multiple semiconductor components to be packed closely together while maintaining effective heat dissipation pathways through the enhanced thermal conductivity of the molding material
Solution Approach 2:
The thermally conductive particles act as intermediaries that facilitate heat transfer from the semiconductor die through the molding compound to the package exterior. These particles create efficient thermal pathways that enable high integration density by mediating the heat flow between closely spaced components and the external environment
3Speed
If clock frequency is increased, then processing speed is improved, but heat generation increases
Solution Approach 1:
The patent uses a molding compound infused with thermally conductive particles that actively conducts heat away from high-frequency processing areas. This composite material enables the semiconductor device to operate at higher clock frequencies by providing efficient thermal pathways that prevent heat buildup during high-speed operation
Solution Approach 2:
The thermally conductive particles create continuous thermal pathways throughout the molding compound, ensuring uninterrupted heat flow from the semiconductor die during high-frequency operation. This continuous heat dissipation action allows sustained high clock frequencies without thermal throttling or performance degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves heat dissipation, enhancing the reliability and performance of semiconductor packages by allowing for higher integration density and operation at higher clock frequencies, thus reducing manufacturing costs and overheating-related failures.
Implementation Method 1
metal paste inclusions, such as copper or silver, which are cured in a reflow process to enhance thermal conductivity and improve heat dissipation
Data Source
AI summary
A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.