Integrated Fan-Out Package Conductive Post Transfer
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Solution Overview
Problem
The semiconductor industry faces challenges in reducing fabrication costs of integrated fan-out packages, which are becoming increasingly popular for their compactness, while maintaining high integration density and efficiency.
Innovation Solution
The process involves pre-fabricating conductive posts with a high aspect ratio using a straight cutting process, which are then transfer-bonded to an adhesive layer on a substrate, allowing for reduced fabrication costs and cycle time by avoiding sputtering, photolithography, and photoresist stripping processes, and subsequently encapsulating an integrated circuit component with an insulating material and forming a redistribution circuit structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional sputtering, photolithography, and photoresist stripping processes are used to fabricate conductive posts, then manufacturing precision can be maintained, but fabrication cost and cycle time increase significantly
Solution Approach 1:
Conductive posts are pre-fabricated on a separate carrier substrate with precise height control before being transfer-bonded to the final substrate. This preliminary fabrication allows precise height control to be achieved in a dedicated process step rather than during the main package fabrication, reducing overall cycle time and cost while maintaining manufacturing precision.
Solution Approach 2:
The fabrication process is segmented into separate steps: conductive posts are fabricated on a carrier substrate, then transfer-bonded to the final substrate. This segmentation allows each process to be optimized independently, reducing the need for complex, costly processes like sputtering and photolithography in the main fabrication line.
2Area of stationary object
If integrated fan-out packages use compact designs with high integration density, then package size is reduced, but fabrication complexity and cost increase
Solution Approach 1:
Multiple conductive posts are pre-fabricated on a carrier substrate in an array pattern before being transfer-bonded to the final substrate. This preliminary action allows complex high-density interconnect patterns to be created using simpler, more cost-effective processes on the carrier, then transferred as a complete array to the final package, reducing fabrication complexity while achieving compact high-density designs.
Solution Approach 2:
Multiple conductive posts are fabricated and transferred as a complete array rather than individually. This merging of multiple fabrication operations into a single transfer step reduces overall fabrication complexity and enables compact package designs with high integration density to be achieved more efficiently.
3Manufacturing precision
If conductive posts with high aspect ratio are fabricated using conventional methods, then manufacturing precision can be maintained, but fabrication cycle time increases
Solution Approach 1:
Conductive posts with high aspect ratios are pre-fabricated on a carrier substrate using dedicated processes optimized for this specific geometry. This preliminary action allows precise aspect ratio control to be achieved in a specialized process step, then the completed posts are rapidly transfer-bonded to the final substrate, reducing overall fabrication cycle time while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces fabrication costs and cycle time, increases yield rate, and allows for precise control of post height variations, resulting in a cost-effective and efficient integrated fan-out package with improved integration density.
Implementation Method 1
a patterned adhesive is provided. The conductive posts are partially embedded in the patterned adhesive
Data Source
AI summary
A method for fabricating an integrated fan-out package is provided. The method includes the following steps. A plurality of conductive posts are placed in apertures of a substrate. A carrier having an adhesive thereon is provided. The conductive posts are transferred to the carrier in a standing orientation by adhering the conductive posts in the apertures to the adhesive. An integrated circuit component is mounted onto the adhesive having the conductive posts adhered thereon. An insulating encapsulation is formed to encapsulate the integrated circuit component and the conductive posts. A redistribution circuit structure is formed on the insulating encapsulation, the integrated circuit component, and the conductive posts, wherein the redistribution circuit structure is electrically connected to the integrated circuit component and the conductive posts. The carrier is removed. At least parts of the adhesive are removed (e.g. patterned or entirely removed) to expose surfaces of the conductive posts. A plurality of conductive terminals are formed on the surfaces of the conductive posts exposed by the openings.