3D Fan-Out IC Package Direct Routing
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Solution Overview
Problem
Integrated circuit packages face limitations in size, complexity, cost, reliability, current carrying capacity, and signal frequency due to complex substrate routing and parasitic capacitance and inductance, particularly when trying to connect semiconductor die pads to external pins with different pitches.
Innovation Solution
The implementation of a direct routing system using flexible conductors, such as wire-like conductors or carbon nano-tubes, to connect semiconductor die contacts directly to substrate contacts, eliminating the need for complex multi-layer interconnects and allowing for improved packaging efficiency and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If complex multi-layer interconnects are used to route signals from die pads to external pins, then signal routing capability is improved, but package size and manufacturing complexity increase
Solution Approach 1:
The patent extracts the routing function from the substrate and implements it through discrete flexible conductors that directly connect die contacts to substrate contacts. This eliminates the need for complex multi-layer interconnect structures within the substrate, simplifying the overall package design while maintaining routing capability.
Solution Approach 2:
The patent introduces flexible conductors as intermediary elements between the die and substrate contacts. These conductors serve as mediators that provide the necessary routing functionality without requiring complex integrated interconnect layers, thus reducing package complexity.
2Adaptability or versatility
If more routing layers are added to connect all pins, then signal routing capability is improved, but manufacturing cost and reliability risk increase
Solution Approach 1:
The routing functionality is extracted from the substrate manufacturing process and implemented separately using flexible conductors. This approach avoids the need for additional routing layers in the substrate, thereby reducing manufacturing complexity and cost while maintaining full routing capability.
3Adaptability or versatility
If complex substrate routing is used, then signal routing capability is improved, but current carrying capacity and signal frequency are limited due to parasitic effects
Solution Approach 1:
The patent replaces the traditional planar substrate routing mechanism with three-dimensional flexible conductors. This substitution allows for more direct signal paths with fewer parasitic effects, improving current carrying capacity and signal frequency performance while maintaining routing capability.
4Adaptability or versatility
If pitch of die pads is different from pitch of external pins, then adaptability to different devices is improved, but routing complexity increases
Solution Approach 1:
The patent uses flexible conductors that can be dynamically configured to accommodate different pitch requirements between die pads and external pins. This dynamic flexibility allows the same package structure to handle various pitch configurations without increasing routing complexity.
Solution Approach 2:
The patent transitions from two-dimensional planar routing to three-dimensional routing using flexible conductors. This dimensional change provides additional routing freedom to accommodate different pitch configurations without increasing complexity, as the conductors can be positioned and routed in multiple spatial dimensions.
Data Source
AI summary
An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of conductors for providing direct connections between substrate contacts and die contacts, respectively. By having the conductors directly route the connections between the die contacts and substrate contacts, many improvements may be realized including, but not limited to, improved package routing capabilities, reduced die and/or package size, improved package reliability, improved current handling capacity, improved speed, improved thermal performance, and lower costs.