Integrated Shield Structure in Fan-Out Packaging for EMI Control
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Solution Overview
Problem
Conventional methods for shielding semiconductor devices from electromagnetic interference are costly and impractical, particularly when using pre-formed copper lids or fully embedded copper shields in packaging processes.
Innovation Solution
A conductive wall is formed on a redistribution structure and a conductive cap is disposed on the encapsulant, both electrically connected to create a shield structure that protects the semiconductor die from electromagnetic interference using efficient wafer-level or panel-level processing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If pre-formed copper lids or fully embedded copper shields are used for electromagnetic shielding, then shielding effectiveness is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The shield structure is divided into multiple segments including a first conductive wall formed on the redistribution structure, a second conductive wall formed on the encapsulant, and interconnecting conductive elements. This segmentation allows each part to be manufactured and positioned independently, reducing overall manufacturing complexity while maintaining shielding effectiveness.
Solution Approach 2:
The shield structure transitions from traditional three-dimensional enclosed shields to a planar configuration where conductive walls are formed on opposite surfaces of the encapsulant. This dimensional simplification reduces manufacturing complexity while maintaining electromagnetic shielding capability through the conductive path between walls.
2Object-affected harmful factors
If traditional encapsulation processes are used without integrated shielding, then manufacturing simplicity is maintained, but electromagnetic shielding effectiveness is lost
Solution Approach 1:
The shield structure is merged with the encapsulation package by forming conductive walls directly on the redistribution structure and encapsulant surfaces. This integration combines the protective encapsulation function with the electromagnetic shielding function into a single unified structure, avoiding the need for separate shield components.
Solution Approach 2:
The conductive walls serve multiple functions: they provide electromagnetic shielding, act as structural components of the package, and can be electrically connected to ground references. This multi-functionality reduces the need for additional dedicated shield components, simplifying the overall device complexity.
3Object-affected harmful factors
If conductive walls are formed on both sides of encapsulant with interconnecting elements, then shielding effectiveness is improved, but manufacturing steps increase
Solution Approach 1:
The conductive walls are formed on the redistribution structure and encapsulant during the encapsulation process itself, before final assembly. This preliminary formation of shield structures allows subsequent steps to focus solely on interconnection, improving overall manufacturing efficiency by avoiding post-assembly shield installation.
Solution Approach 2:
Conductive elements serve as intermediaries connecting the first and second conductive walls, providing both electrical connection and mechanical bonding. This intermediary approach simplifies the manufacturing process by combining multiple functions (electrical connection, mechanical attachment, shielding continuity) into a single element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields semiconductor devices from electromagnetic interference while being cost-effective and practical, allowing for the production of efficiently shielded packaged semiconductor devices.
Implementation Method 1
a shield structure configured to protect the semiconductor die from electromagnetic interference
Data Source
AI summary
Several aspects of the present technology are directed toward fan-out packaged semiconductor devices having an integrated shield. The shield can include a conductive wall and a conductive cap over a redistribution structure. The shield can surround or at least partially enclose circuits placed or formed on the redistribution structure. The circuits and/or the conductive cap can be covered by an encapsulant, and the conductive cap can be on an upper surface of an encapsulant.