Fan-Out Flexible Microsystem With Polymer Trenches
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current flexible electronics fabrication methods face challenges in achieving reliable structural strength and excellent electrical performance, particularly due to the limitations of organic semiconductors and the structural weaknesses of silicon-based devices with thin thickness.
Innovation Solution
A fan-out multi-device hybrid integrated flexible micro system is developed, incorporating MEMS or IC chips with flexible connection through high aspect ratio silicon trenches filled with parylene or other flexible polymers, and a metal wiring layer for electrical interconnection, allowing for robust and flexible interconnections between device units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic semiconductor materials are used to achieve flexibility, then the fabrication process becomes simple and flexible, but the carrier mobility remains low (much smaller than silicon)
Solution Approach 1:
The patent employs a composite structure combining rigid silicon-based chips with flexible polymer materials. The silicon chips provide high carrier mobility and excellent electrical properties, while the flexible polymer substrate and encapsulation layers provide mechanical flexibility and ductility. This composite approach resolves the contradiction by integrating the advantages of both material systems rather than relying solely on organic semiconductors.
2Shape
If silicon-based structures are made thin to achieve flexibility, then flexibility is improved, but structural strength and reliability deteriorate
Solution Approach 1:
The patent uses flexible polymer encapsulation layers and thin film structures to provide the necessary flexibility while maintaining structural integrity. The flexible polymer material forms a protective shell around the silicon chips, allowing the device to bend and deform without compromising the strength of the underlying silicon components. This approach enables flexibility through the encapsulation layer rather than by thinning the structural silicon chips themselves.
3Productivity
If fan-out package technology is used to achieve hybrid integration, then multiple devices can be integrated and batch processing efficiency improves, but the structural complexity increases
Solution Approach 1:
The patent divides the device structure into distinct functional segments: silicon-based chip units, flexible polymer connection layers, and encapsulation layers. This segmentation allows each component to be fabricated and processed independently using standardized batch processing techniques, then assembled into the final integrated structure. The modular segmented design simplifies the overall manufacturing process while enabling hybrid integration of multiple device types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of flexible micro systems with complete functions and superior electrical properties, ensuring structural strength and normal operation of complex devices by using silicon-based chips and flexible polymer connections.
Implementation Method 1
the polymer can include parylene and other flexible materials which are formed by the chemical vapor deposition process
Data Source
AI summary
The invention discloses a fan-out multi-device hybrid integrated flexible micro-system and an associated fabrication method in the field of microelectronics. The flexible microsystem uses microelectromechanical system (MEMS) chips and/or integrated circuit (IC) chips as the device units, flexible isolation trenches filled with flexible polymer as a flexible connection between the device units, and metal wiring layers to provide electrical interconnections between the device units. The disclosed multi-device hybrid integrated flexible micro-system completed by a fan-out method not only retains excellent electrical performance of silicon-based devices, but also realizes flexibility of the overall micro-system, and has stable structure and reliable performance.